# US 8,569,869 B2 · Integrated circuit packaging system with encapsulation and method of manufacture thereof

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- Number: US 8,569,869 B2
- Document ID: US8569869B2
- Status: Granted
- Kind: B2
- Application number: 12/729,841
- Filed: 2010-03-23
- Published: 2011-09-29
- Granted: 2013-10-29
- Earliest claimed: 2010-03-23
- Assignees: STATS ChipPAC, Ltd.
- Applicants: HyungSang Park; A Leam Choi; JoHyun Bae
- Inventors: HyungSang Park; A Leam Choi; JoHyun Bae
- Web page: https://patentgrep.com/patent/US8569869B2

## CPC

- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 74/017: {Auxiliary layers for moulds, e.g. release layers or layers preventing residue}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/00: Package configurations
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 46/101: {characterised by the type of information, e.g. logos or symbols}
- H10W 46/301: {for alignment}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/635: {Through-vias}
- H10W 72/072: {of bump connectors}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07354: {changes in dispositions}
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/347: {Dispositions of multiple die-attach connectors}
- H10W 72/354: {comprising polymers}
- H10W 72/856: {Bump connectors and die-attach connectors (bumps embedded in underfills H10W74/15)}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 74/10: characterised by their shape or disposition
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 76/17: characterised by their materials
- H10W 90/288: {characterised by arrangements for thermal management of the stacked chips}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; mounting a rounded interconnect on the package carrier; mounting a conductive shield over the package carrier, the conductive shield having an elevated portion and a hole adjacent to the elevated portion with the elevated portion over the integrated circuit and the rounded interconnect exposed from the hole; and forming an encapsulation between the conductive shield and the package carrier with the rounded interconnect exposed.

## Claims

### Claim 1

A method of manufacture of an integrated circuit packaging system comprising:
mounting an integrated circuit over a package carrier;
mounting a rounded interconnect on the package carrier;
mounting a conductive shield over the package carrier, the conductive shield having an elevated portion and a perimeter portion below the elevated portion, the perimeter portion having a hole, wherein the rounded interconnect is mounted within the hole, and wherein the hole exposes the rounded interconnect from the conductive shield; and
forming an encapsulation between the conductive shield and the package carrier with the rounded interconnect exposed from the encapsulation.

### Claim 2 (depends on 1)

The method as claimed in claim 1 wherein forming the encapsulation includes forming the encapsulation within the hole, the rounded interconnect isolated from the conductive shield by the encapsulation.

### Claim 3 (depends on 1)

The method as claimed in claim 1 wherein mounting the rounded interconnect includes mounting the rounded interconnect below the elevated portion.

### Claim 4 (depends on 1)

The method as claimed in claim 1 wherein mounting the conductive shield includes mounting the conductive shield having a fiducial mark thereon.

### Claim 5 (depends on 1)

The method as claimed in claim 1 wherein mounting the conductive shield includes mounting the conductive shield having an edge, a corner extension, and another of the corner extension, the edge between the corner extension and another of the corner extension.

### Claim 6

A method of manufacture of an integrated circuit packaging system comprising:
mounting an integrated circuit over a package carrier;
mounting a rounded interconnect on the package carrier;
attaching an adhesive to the integrated circuit;
mounting a conductive shield over the package carrier, the conductive shield having an elevated portion and a perimeter portion below the elevated portion, the elevated portion attached to the adhesive, the perimeter portion having a hole, wherein the rounded interconnect is mounted within the hole, and wherein the hole exposes the rounded interconnect from the conductive shield; and
forming an encapsulation between the conductive shield and the package carrier with the rounded interconnect exposed from the encapsulation.

### Claim 7 (depends on 6)

The method as claimed in claim 6 further comprising:
mounting a component over the package carrier; and
wherein:
mounting the conductive shield includes mounting the elevated portion over the component.

### Claim 8 (depends on 6)

The method as claimed in claim 6 further comprising attaching an external interconnect to the package carrier, the conductive shield grounded with the external interconnect.

### Claim 9 (depends on 6)

The method as claimed in claim 6 further comprising mounting a mold chase having a buffer layer over the conductive shield.

### Claim 10 (depends on 6)

The method as claimed in claim 6 wherein mounting the integrated circuit includes mounting a flip chip over the package carrier.

### Claim 11

An integrated circuit packaging system comprising
a package carrier;
an integrated circuit over the package carrier;
a rounded interconnect on the package carrier;
a conductive shield over the package carrier, the conductive shield having an elevated portion and a perimeter portion below the elevated portion, the perimeter portion having a hole, the rounded interconnect within the hole, and wherein the hole exposes the rounded interconnect from the conductive shield; and
an encapsulation between the conductive shield and the package carrier with the rounded interconnect exposed from the encapsulation.

### Claim 12 (depends on 11)

The system as claimed in claim 11 wherein the encapsulation is within the hole, the rounded interconnect isolated from the conductive shield by the encapsulation.

### Claim 13 (depends on 11)

The system as claimed in claim 11 wherein the rounded interconnect is below the elevated portion.

### Claim 14 (depends on 11)

The system as claimed in claim 11 wherein the conductive shield has a fiducial mark thereon.

### Claim 15 (depends on 11)

The system as claimed in claim 11 wherein the conductive shield includes an edge and a corner extension, the edge between the corner extension and another of the corner extension.

### Claim 16 (depends on 11)

The system as claimed in claim 11 further comprising
an adhesive attached to the integrated circuit; and
wherein:
the conductive shield having the elevated portion attached to the adhesive; and
the rounded interconnect extending through the hole.

### Claim 17 (depends on 16)

The system as claimed in claim 16 further comprising:
a component over the package carrier; and
wherein:
the conductive shield includes the elevated portion over the component.

### Claim 18 (depends on 16)

The system as claimed in claim 16 further comprising an external interconnect attached to the package carrier, the conductive shield grounded with the external interconnect.

### Claim 19 (depends on 16)

The system as claimed in claim 16 wherein the conductive shield over the package carrier includes the conductive shield having a corner extension on the package carrier.

### Claim 20 (depends on 16)

The system as claimed in claim 16 wherein the integrated circuit is a flip chip over the package carrier.