# US 8,569,792 B2 · Silicone resin sheet, producing method thereof, encapsulating sheet, and light emitting diode device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,569,792 B2 - Document ID: US8569792B2 - Status: Granted - Kind: B2 - Application number: 13/605,632 - Filed: 2012-09-06 - Published: 2013-03-21 - Granted: 2013-10-29 - Earliest claimed: 2011-09-21 - Assignees: Nitto Denko Corporation - Applicants: Munehisa Mitani; Hiroyuki Katayama - Inventors: Munehisa Mitani; Hiroyuki Katayama - Web page: https://patentgrep.com/patent/US8569792B2 ## CPC - C08L 83/04: Polysiloxanes - C09D 183/04: Polysiloxanes - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10W 74/476: {Organic materials comprising silicon} - C08G 77/12: containing silicon bound to hydrogen - C08G 77/20: containing silicon bound to unsaturated aliphatic groups - Y10T 428/31663: As siloxane, silicone or silane - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A method for producing a silicone resin sheet includes the steps of forming a first coating layer by applying a first silicone resin composition which contains a first organopolysiloxane and a second organopolysiloxane; forming a precursor layer from the first coating layer by reacting the first organopolysiloxane with the second organopolysiloxane so as to have a conversion ratio of 5 to 40%; and forming a second layer on at least one surface in a thickness direction of the precursor layer by applying a second silicone resin composition which contains a third organopolysiloxane, a fourth organopolysiloxane, a hydrosilylation catalyst, and a curing retardant containing tetraalkylammonium hydroxide. ## Claims ### Claim 1 A method for producing a silicone resin sheet, comprising the steps of: forming a first coating layer by applying a first silicone resin composition which contains a first organopolysiloxane having at least two alkenylsilyl groups in one molecule and a second organopolysiloxane having at least two hydrosilyl groups in one molecule; forming a precursor layer from the first coating layer by reacting the first organopolysiloxane with the second organopolysiloxane so as to have a conversion ratio of 5 to 40%; and forming a second layer on at least one surface in a thickness direction of the precursor layer by applying a second silicone resin composition which contains a third organopolysiloxane having at least two alkenylsilyl groups in one molecule, a fourth organopolysiloxane having at least two hydrosilyl groups in one molecule, a hydrosilylation catalyst, and a curing retardant containing tetraalkylammonium hydroxide. ### Claim 2 (depends on 1) The method for producing a silicone resin sheet according to claim 1, wherein in the step of forming the precursor layer, the first organopolysiloxane is reacted with the second organopolysiloxane by heating the first coating layer. ### Claim 3 (depends on 1) The method for producing a silicone resin sheet according to claim 1, wherein in the step of forming the precursor layer, the first organopolysiloxane is reacted with the second organopolysiloxane by heating the first coating layer at 80 to 110° C. for 3 to 8 minutes. ### Claim 4 (depends on 1) The method for producing a silicone resin sheet according to claim 1, further comprising the step of semi-curing the second layer. ### Claim 5 (depends on 1) The method for producing a silicone resin sheet according to claim 1, wherein the alkenylsilyl group is a vinylsilyl group. ### Claim 6 (depends on 1) The method for producing a silicone resin sheet according to claim 1, wherein the first silicone resin composition or the second silicone resin composition contains a functionality-imparting agent. ### Claim 7 (depends on 1) The method for producing a silicone resin sheet according to claim 1, wherein the first silicone resin composition contains a first functionality-imparting agent and the second silicone resin composition contains a second functionality-imparting agent which has a different function from that of the first functionality-imparting agent. ### Claim 8 A silicone resin sheet comprising: a first layer formed by reacting a first silicone resin composition which contains a first organopolysiloxane having at least two alkenylsilyl groups in one molecule and a second organopolysiloxane having at least two hydrosilyl groups in one molecule so as to have a conversion ratio of 5 to 40% and a second layer laminated on at least one surface in a thickness direction of the first layer and formed from a second silicone resin composition which contains a third organopolysiloxane having at least two alkenylsilyl groups in one molecule, a fourth organopolysiloxane having at least two hydrosilyl groups in one molecule, a hydrosilylation catalyst, and a curing retardant containing tetralkylammonium hydroxide. ### Claim 9 (depends on 8) The silicone resin sheet according claim 8, wherein the second layer is in a semi-cured state. ### Claim 10 An encapsulating sheet made of a silicone resin sheet, wherein the silicone resin sheet comprises: a first layer formed by reacting a first silicone resin composition which contains a first organopolysiloxane having at least two alkenylsilyl groups in one molecule and a second organopolysiloxane having at least two hydrosilyl groups in one molecule so as to have a conversion ratio of 5 to 40% and a second layer laminated on at least one surface in a thickness direction of the first layer and formed from a second silicone resin composition which contains a third organopolysiloxane having at least two alkenylsilyl groups in one molecule, a fourth organopolysiloxane having at least two hydrosilyl groups in one molecule, a hydrosilylation catalyst, and a curing retardant containing tetralkylammonium hydroxide. ### Claim 11 A light emitting diode device comprising: a board, a light emitting diode element mounted on the board, and an encapsulating sheet formed on one surface in a thickness direction of the board so as to encapsulate the light emitting diode element, wherein the encapsulating sheet is made of a silicone resin sheet, and the silicone resin sheet comprises: a first layer formed by reacting a first silicone resin composition which contains a first organopolysiloxane having at least two alkenylsilyl groups in one molecule and a second organopolysiloxane having at least two hydrosilyl groups in one molecule so as to have a conversion ratio of 5 to 40% and a second layer laminated on at least one surface in a thickness direction of the first layer and formed from a second silicone resin composition which contains a third organopolysiloxane having at least two alkenylsilyl groups in one molecule, a fourth organopolysiloxane having at least two hydrosilyl groups in one molecule, a hydrosilylation catalyst, and a curing retardant containing tetralkylammonium hydroxide.