LED and method for manufacturing the same
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsPin-Chuan Chen, Hsin-Chiang Lin
Life of this patent
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Abstract
An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber.
Claims10
An LED (light emitting diode) comprising:
- a pair of leads spaced from each other;
- a chip electrically connected to the leads;
- a housing fixed on the leads, the housing defining a cavity to receive the chip;
- and
- an encapsulant filling the cavity to seal the chip;
- wherein the encapsulant comprises an upper portion and a lower portion, the lower portion having a bottom face joining the leads and a top face connected to the upper portion;
- wherein the lower portion of the encapsulant is expanded from the top face towards the bottom face thereof;
- wherein a block is formed between the two leads to interconnect the two leads;
- and
- wherein the block defines two grooves in interfaces between the block and the two leads, respectively, the two grooves being located at a top face of the block and filled with the encapsulant.
Dependencies are inferred from the claim text.