# US 8,569,790 B2 · Light emitting diode package having interconnection structures

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- Number: US 8,569,790 B2
- Document ID: US8569790B2
- Status: Granted
- Kind: B2
- Application number: 13/781,771
- Filed: 2013-03-01
- Published: 2013-07-11
- Granted: 2013-10-29
- Earliest claimed: 2010-09-10
- Assignees: Advanced Optoelectronic Technology, Inc.
- Applicants: Advanced Optoelectronic Technology, Inc.
- Inventors: Chao-Hsiung Chang; Pi-Chiang Hu
- Web page: https://patentgrep.com/patent/US8569790B2

## CPC

- H10H 20/83: Electrodes
- H10H 20/813: having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
- H10W 90/00: Package configurations
- H10H 20/8506: {Containers}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 90/753: {between laterally-adjacent chips}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A light emitting diode (LED) package includes a substrate, a first LED chip and a second LED chip. The substrate includes first to fourth electrodes, and an interconnection electrode. A mounting area is defined at center of a top surface of the substrate. The first to fourth electrodes are respectively in four corners of the substrate out of the mounting area. The first interconnection electrode is embedded in the substrate to electrically connect the first and the third electrodes. The first LED chip and the second LED chip are arranged in the mounting area. Each LED chip includes an anode pad and a cathode pad. The first to fourth electrodes are respectively connected to the four pads of the first and the second LED chips via a plurality of metal wires, and no metal wire connection is formed between the first and the second LED chips.

## Claims

### Claim 1

A light emitting diode (LED) package comprising:
a substrate comprising a first electrode, a second electrode, a third electrode, a fourth electrode, and an interconnection electrode, a mounting area defined at center of a top surface of the substrate, the first to fourth electrodes respectively positioned in four corners of the substrate out of the mounting area and exposed from the top surface of the substrate, the first interconnection electrode embedded in the substrate to electrically connect the first and the third electrodes; and
a first LED chip and a second LED chip arranged on the mounting area, each LED chip comprising an anode pad and a cathode pad;
wherein the first to fourth electrodes are respectively connected to the four pads of the first and the second LED chips via a plurality of metal wires, and no metal wire connection is formed between the first and the second LED chips.

### Claim 2 (depends on 1)

The LED package of claim 1, wherein the first to fourth electrodes have top surfaces coplanar to the top surface of the substrate.

### Claim 3 (depends on 1)

The LED package of claim 1, wherein the first and the fourth electrodes extend from the top surface to a bottom surface of the substrate and protrude from the bottom surface of the substrate.

### Claim 4 (depends on 1)

The LED package of claim 1, wherein the first LED chip and the second LED chip are connected in series between the first and the fourth electrodes.

### Claim 5 (depends on 1)

The LED package of claim 1, wherein the first and the fourth electrode are located at two opposite diagonal corners of the substrate, and the second and the third electrodes are located at other two opposite diagonal corners of the substrate.

### Claim 6 (depends on 1)

The LED package of claim 1, wherein the substrate further comprises a mounting base, a supporting base, and a layout layer sandwiched between the mounting base and the supporting base, the mounting base comprising four mounting holes, the supporting base comprising two exposing holes, the layout layer comprising the first to fourth electrodes and the interconnection electrode formed thereon.

### Claim 7 (depends on 6)

The LED package of claim 6, wherein the second and the third electrodes are received in corresponding mounting holes and top ends of the second and the third electrodes are exposed from a top surface of the mounting base.

### Claim 8 (depends on 6)

The LED package of claim 6, wherein the first and the fourth electrodes are received in the exposing holes and corresponding mounting holes, top ends of the first and the fourth electrodes are exposed from the top surface of the mounting base, the bottom ends of the first and the fourth electrodes are protruded from a bottom surface of the supporting base.

### Claim 9 (depends on 6)

The LED package of claim 6, wherein the mounting base, the layout layer, and the supporting base are integrated together into a single piece using low temperature cofired ceramics (LTCC) technology.