Optoelectronic semiconductor component
AssigneeOSRAM Opto Semiconductors GmbH
InventorGertrud Kräuter
Life of this patent
Estimating the term…
Abstract
An optoelectronic semiconductor component includes a housing main body and at least one optoelectronic semiconductor chip mounted on the housing main body. In operation, the optoelectronic semiconductor chip emits primary radiation including an ultraviolet radiation fraction. The semiconductor component also includes a filter medium that absorbs the ultraviolet radiation fraction and is located at least in part between the semiconductor chip and the housing main body and/or between the semiconductor chip and an optical component.
Claims16
An optoelectronic semiconductor component comprising:
- a housing main body,
- at least one optoelectronic semiconductor chip mounted on the housing main body that emits primary radiation, the primary radiation comprising an ultraviolet radiation fraction, and
- a filter medium which absorbs the ultraviolet radiation fraction of the primary radiation, the filter medium being located at least in part between the semiconductor chip and the housing main body or between the semiconductor chip and an optical component, and the ultraviolet radiation fraction constituting a proportion of the total optical power of the primary radiation of 0.1% to 4.0%.
An optoelectronic semiconductor component comprising:
- a housing main body,
- at least one optoelectronic semiconductor chip mounted on the housing main body and emits primary radiation, the primary radiation comprising an ultraviolet radiation fraction, and
- a filter medium that absorbs the ultraviolet radiation fraction of the primary radiation, and is located at least in part between the semiconductor chip and the housing main body or between the semiconductor chip and an optical component, the ultraviolet radiation fraction constituting a proportion of the total optical power of the primary radiation of 0.1% to 4.0%, wherein the filter medium is deposited epitaxially on the semiconductor chip in at least one layer, and the filter medium is in direct contact with the semiconductor chip.
Dependencies are inferred from the claim text.