# US 8,569,781 B2 · LED package with light-absorbing layer

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- Number: US 8,569,781 B2
- Document ID: US8569781B2
- Status: Granted
- Kind: B2
- Application number: 13/288,042
- Filed: 2011-11-03
- Published: 2012-09-20
- Granted: 2013-10-29
- Earliest claimed: 2011-03-15
- Assignees: Advanced Optoelectronic Technology, Inc.
- Applicants: Pi-Chiang Hu; Shih-Yuan Hsu; Kai-Lun Wang
- Inventors: Pi-Chiang Hu; Shih-Yuan Hsu; Kai-Lun Wang
- Web page: https://patentgrep.com/patent/US8569781B2

## CPC

- H10H 20/8506: {Containers}
- H10H 20/856: Reflecting means
- H10H 20/036: {of packages}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An LED package comprises a substrate, a reflector, a light-absorbing layer, an encapsulation layer and an LED chip. The light-absorbing layer is located around the reflector and is able to absorb any light which penetrates through the reflector. Therefore, any vignetting or halation of light from the LED package is prevented. Moreover, the LED package can be constructed on a very small scale with no reduction in its color rendering properties.

## Claims

### Claim 1

An LED package, comprising:
a substrate, having two electrodes located thereon;
an LED chip, disposed on the substrate and, respectively, electrically connecting to the two electrodes;
a reflector, defining a depression located on the substrate, wherein the LED chip is disposed inside the depression;
a light-absorbing layer, located on the substrate around the reflector, the light-absorbing layer being a paste; and
an encapsulation layer, located inside the depression, covering the LED chip.

### Claim 2 (depends on 1)

The LED package as claimed in claim 1, wherein the two electrodes comprise a cathode and an anode respectively extending from a top surface of the substrate to an opposite bottom surface.

### Claim 3 (depends on 2)

The LED package as claimed in claim 2, wherein the depression is located on the top surface of the substrate.

### Claim 4 (depends on 1)

The LED package as claimed in claim 1, wherein the LED chip electrically connects to the two electrodes via conductive wires.

### Claim 5 (depends on 1)

The LED package as claimed in claim 1, wherein the reflector is light-reflective made by plastic or polymer selected from polyphthalamide (PPA) or epoxy resin.

### Claim 6 (depends on 1)

The LED package as claimed in claim 1, wherein the light-absorbing layer is light-absorbing made by plastic or polymer selected from PPA or epoxy resin.

### Claim 7 (depends on 6)

The LED package as claimed in claim 6, wherein the light-absorbing layer is black with a light absorbance over 70%.

### Claim 8 (depends on 1)

The LED package as claimed in claim 1, wherein the encapsulation layer is a transparent colloid comprising one luminescent conversion element.

### Claim 9 (depends on 1)

The LED package as claimed in claim 1, wherein the reflector and the light-absorbing layer are formed separately by twice molding.

### Claim 10 (depends on 1)

The LED package as claimed in claim 1, wherein the reflector is formed by molding and the light-absorbing layer is made by coating or bonding.

### Claim 11

An LED package, comprising:
a substrate, having a reflector defining a depression and two electrodes located on a top surface of the substrate;
an LED chip, disposed inside the depression and, respectively, electrically connecting to the two electrodes;
a light-absorbing layer, located on the substrate around the reflector, the light-absorbing layer being a paste; and
an encapsulation layer, located inside the depression, covering the LED chip.

### Claim 12 (depends on 11)

The LED package as claimed in claim 11, wherein the two electrodes comprise a cathode and an anode respectively extending from the top surface to an opposite bottom surface of the substrate.

### Claim 13 (depends on 11)

The LED package as claimed in claim 11, wherein the substrate and the reflector are integrated.

### Claim 14 (depends on 13)

The LED package as claimed in claim 13, wherein the substrate and the reflector are formed by molding.

### Claim 15 (depends on 11)

The LED package as claimed in claim 11, wherein the LED chip electrically connects to the two electrodes via conductive wires.

### Claim 16 (depends on 11)

The LED package as claimed in claim 11, wherein the reflector is light-reflective made by plastic or polymer selected from PPA or epoxy resin.

### Claim 17 (depends on 11)

The LED package as claimed in claim 11, wherein the light-absorbing layer is light-absorbing made by plastic or polymer selected from PPA or epoxy resin.

### Claim 18 (depends on 17)

The LED package as claimed in claim 17, wherein the light-absorbing layer is black with a light absorbance over 70%.

### Claim 19 (depends on 11)

The LED package as claimed in claim 11, wherein the encapsulation layer is a transparent colloid comprising one luminescent conversion element.

### Claim 20 (depends on 11)

The LED package as claimed in claim 11, wherein the light-absorbing layer is made by molding, coating or bonding.