# US 8,569,779 B2 · Light emitting diode package

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- Number: US 8,569,779 B2
- Document ID: US8569779B2
- Status: Granted
- Kind: B2
- Application number: 13/209,451
- Filed: 2011-08-15
- Published: 2012-06-21
- Granted: 2013-10-29
- Earliest claimed: 2010-12-21
- Assignees: Advanced Optoelectronic Technology, Inc.
- Applicants: Kai-Lun Wang; Shih-Yuan Hsu; Hou-Te Lin
- Inventors: Kai-Lun Wang; Shih-Yuan Hsu; Hou-Te Lin
- Web page: https://patentgrep.com/patent/US8569779B2

## CPC

- H10H 20/8583: {not being in contact with the bodies}
- H10H 20/856: Reflecting means
- H10H 20/8582: {characterised by their shape}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

An exemplary light emitting diode (LED) package includes a substrate, an electrical member formed on the substrate, an LED chip mounted on the substrate and electrically connected to the electrical member, and a heat-dissipating member formed on the electrical member. The heat-dissipating member helps the LED chip to dissipate heat generated thereby when the LED chip is in operation.

## Claims

### Claim 1

A light emitting diode (LED) package, comprising:
a substrate;
an electrical member formed on the substrate, the electrical member comprising a first electrical member and a second electrical member both extending from a top face of the substrate to a bottom face of the substrate along an outer edge of the substrate;
a heat-dissipating member formed on the electrical member;
an LED chip mounted on the electrical member and electrically connected to the first electrical member and the second electrical member; and
a reflecting cup disposed on the substrate and surrounding the LED chip;
wherein the heat-dissipating member comprises a main body and a plurality of fins extending outwardly from the main body; and
wherein the main body extends through the reflecting cup.

### Claim 2 (depends on 1)

The LED package of claim 1, wherein the fins are perpendicular to the main body.

### Claim 3 (depends on 1)

The LED package of claim 1, wherein the fins extend from the main body and through the reflecting cup to expose to an outside of the reflecting cup.

### Claim 4 (depends on 1)

The LED package of claim 1, wherein the substrate is made of one of Al2O3, silicon, SiC, ceramic, polymer, and electrically insulating quartz.

### Claim 5 (depends on 1)

The LED package of claim 1, further comprising an encapsulant covering the LED chip.

### Claim 6 (depends on 5)

The LED package of claim 5, wherein the encapsulant further comprises fluorescent powder mixed therein.

### Claim 7 (depends on 1)

The LED package of claim 1, wherein the heat-dissipating member comprises a first heat-dissipating member formed on the first electrical member and a second heat-dissipating member formed on the second electrical member.

### Claim 8 (depends on 1)

The LED package of claim 1 further comprising two wires electrically connecting the LED chip to the first electrical member and the second electrical member, respecively.

### Claim 9 (depends on 1)

The LED package of claim 1, wherein each of the fins is parallel to the substrate.

### Claim 10 (depends on 1)

The LED package of claim 1, wherein the reflecting cup is sandwiched between the top face of the substrate and one of the fins.

### Claim 11

An LED package, comprising:
a substrate having a first electrical member and a second electrical member, the first electrical member and the second electrical member respectively extending from a top face of the substrate to a bottom face of the substrate along an outer edge of the substrate;
an LED chip mounted on the first electrical member of the substrate and electrically connected to the first and second electrical members via two wires;
a heat-dissipating member formed on the first electrical member; and
a reflecting cup disposed on the substrate and surrounding the LED chip;
wherein the heat-dissipating member comprises a main body and a plurality of fins extending outwardly from the main body; and
wherein the main body extends through the reflecting cup.

### Claim 12 (depends on 11)

The LED package of claim 11, wherein the fins are perpendicular to the main body.

### Claim 13 (depends on 11)

The LED package of claim 11, wherein the fins extend from the main body and through the reflecting cup to expose to an outside of the reflecting cup.

### Claim 14 (depends on 11)

The LED package of claim 11, wherein the reflecting cup is sandwiched between the top face of the substrate and one of the fins.