Lead frame unit, package structure and light emitting diode device having the same
AssigneesLite-On Electronics (Guangzhou) Limited, Lite-On Technology Corporation
InventorChen-Hsiu Lin
Life of this patent
Estimating the term…
Abstract
A package structure is adapted for mounting at least one light emitting diode (LED) die. The package structure includes an insulating housing, and a lead frame unit including two spaced-apart conductive bodies. Each of the conductive bodies has opposite first and second conductive terminals spaced-apart from each other along an axial direction. The first conductive terminals extend into the insulating housing. The second conductive terminals are exposed outwardly of the insulating housing. Each of the conductive bodies further has two side edges spaced-apart from each other along a transverse direction perpendicular to the axial direction, and a concave-convex structure disposed at the side edges and surrounded by the insulating housing.
Claims15
A package structure adapted for mounting at least one light emitting diode (LED) die, said package structure comprising:
- an insulating housing;
- and
- a lead frame unit including:
- two spaced-apart conductive bodies, each of said conductive bodies having opposite first and second conductive terminals spaced-apart from each other along an axial direction, said first conductive terminal extending into said insulating housing, said second conductive terminal being exposed outwardly of said insulating housing, wherein each of said conductive bodies further has two side edges spaced-apart from each other along a transverse direction perpendicular to the axial direction and extending substantially in parallel to each other along substantially the entire length of said each conductive body, and
- each of said conductive bodies being integrally formed and having a protrusion that extends in a transverse direction from a side surface thereof and that defines a step contoured structural body in an upper section of said conductive body and a ledge being contiguous with a notch formed within said structural body in a lower section of said conductive body;
- said notch and said ledge being configured into a concave-convex structure disposed along each of said two side edges, wherein each said concave-convex structure is surrounded by said insulating housing;
- wherein said each concave-convex structure of at least one of said two conductive bodies has said ledge and notch formed along a respective one of said two side edges of said at least one conductive body;
- wherein, in said each concave-convex structure, said protrusion, said ledge and said at least one notch are disposed each with respect to the other along a direction perpendicular to said axial direction and said transverse direction;
- and
- wherein said at least one conductive body, at a portion thereof surrounded by said insulating housing, has a first width defined along said transverse direction between outermost edges of said protrusions formed at said opposite side edges, and wherein said first width exceeds a width of said second conductive terminal exposed outwardly of said insulating housing.
A light emitting diode (LED) device comprising:
- package structure adapted thr mounting at least one light emitting diode (LED) die, said package structure comprising:
- an insulating housing;
- and
- a lead frame unit including:
- two spaced-apart conductive bodies, each of said conductive bodies having opposite first and second conductive terminals spaced-apart from each other along an axial direction, said first conductive terminal extending into said insulating housing, said second conductive terminal being exposed outwardly of said insulating housing,
- each of said conductive bodies further having two side edges spaced-apart from each other along a transverse direction perpendicular to the axial direction, and extending substantially in parallel to each other along substantially the entire length of said each conductive body, and
- each of said conductive bodies being integrally formed and having a protrusion that extends in a transverse direction from a side surface thereof and that defines a step contoured structural body in an upper section of said conductive body and a ledge being contiguous with a notch formed within said structural body in a lower section of said conductive body;
- said notch and said ledge being configured into a concave-convex structure disposed at each of said two side edges and surrounded by said insulating housing;
- wherein each said concave-convex structure of at least one of said two conductive bodies has said ledge and notch formed along said respective side edge of aid at least one conductive body;
- wherein, in said each concave-convex structure, said protrusion, said ledge and said at least one notch are disposed each with respect to the other along a direction perpendicular to said axial and transverse direction;
- and
- wherein said at least one conductive body, at a portion thereof surrounded by said insulating housing, has a first width defined along said transverse direction between outermost edges of said protrusions formed at said opposite side edges, and wherein said first width exceeds a width of said second conductive terminal exposed outwardly of said insulating housing;
- and
- a light emitting diode (LED) die disposed at one of said conductive bodies and electrically connected to said two conductive bodies.
A lead frame unit, comprising:
- two conductive bodies spaced-apart along an axial direction, at least one of said conductive bodies including a first side edge and a second side edge spaced-apart from each other along a transverse direction perpendicular to the axial direction and extending substantially in parallel to each other along substantially the entire length of said each conductive body,
- each of said conductive bodies being integrally formed and having a protrusion that extends in a transverse direction from a side surface thereof and that defines a step contoured structural body in an upper section of said conductive body and a ledge being contiguous with a notch formed within said structural body in a lower section of said conductive body;
- said notches and said ledge being configured into a concave-convex structure
- wherein said at least one conductive body has a first width defined along said transverse direction between outermost edges of said ledge and said protrusion formed at said opposite side edges, and
- wherein said first width exceeds a width of said at least one conductive body at a location different than a portion formed with said protrusions.
Dependencies are inferred from the claim text.