# US 8,569,772 B2 · Light-emitting element and method of fabricating the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,569,772 B2 - Document ID: US8569772B2 - Status: Granted - Kind: B2 - Application number: 12/839,800 - Filed: 2010-07-20 - Published: 2011-01-20 - Granted: 2013-10-29 - Earliest claimed: 2009-07-20 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Yu-Sik Kim - Inventors: Yu-Sik Kim - Web page: https://patentgrep.com/patent/US8569772B2 ## CPC - H10H 20/816: having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures - H10H 20/8316: {Multi-layer electrodes comprising at least one discontinuous layer} - H10H 20/018: {Bonding of wafers} - H10H 20/032: {of electrodes} - H10H 20/8312: {extending at least partially through the bodies} - H10H 20/833: Transparent materials - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 90/00: Package configurations - Y10S 257/918: Light emitting regenerative switching device, e.g. light emitting scr arrays, circuitry - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ## Abstract Provided are a light-emitting element and a method of fabricating the same. The light-emitting element includes: a first pattern including conductive regions and non-conductive regions. The non-conductive regions are defined by the conductive regions. The light-emitting element also include an insulating pattern including insulating regions and non-insulating regions which correspond respectively to the conductive regions and non-conductive regions. The non-insulating regions are defined by the insulating regions. The light-emitting element further includes a light-emitting structure interposed between the first pattern and the insulating pattern. The light-emitting structure includes a first semiconductor pattern of a first conductivity type, a light-emitting pattern, and a second semiconductor pattern of a second conductivity type which are stacked sequentially. The light-emitting element also includes a second pattern formed in the non-insulating regions. ## Claims ### Claim 1 A light-emitting element comprising: a first pattern comprising conductive regions and non-conductive regions, the non-conductive regions being defined by the conductive regions; an insulating pattern comprising insulating regions and non-insulating regions which correspond respectively to the conductive regions and the non-conductive regions, the non-insulating regions being defined by the insulating regions; a fight-emitting structure interposed between the first pattern and the insulating pattern, the light-emitting structure comprising a first semiconductor pattern of a first conductivity type, a light-emitting pattern, and a second semiconductor pattern of a second conductivity type which are stacked sequentially; and a second pattern formed in the non-insulating regions wherein edges of the second pattern in the non-insulating regions are aligned below edges of the non-conductive regions having same latitude dimensions. ### Claim 2 (depends on 1) The light-emitting element of claim 1, wherein the non-insulating regions do not overlap the conductive regions. ### Claim 3 (depends on 1) The light-emitting element of claim 1, wherein the first pattern is a transparent conductor. ### Claim 4 (depends on 1) The light-emitting element of claim 1, wherein the conductive regions are in at least one of a dotted form, a mesh form, and a linear form. ### Claim 5 (depends on 1) The light-emitting element of claim 1, wherein the conductive regions overlap the insulating regions. ### Claim 6 (depends on 1) The light-emitting element of claim 1, further comprising: a substrate having a first wiring pattern and a second wiring pattern each on at least a first surface of the substrate, wherein the first pattern is electrically connected to the first wiring pattern and the second pattern is electrically connected to the second wiring pattern. ### Claim 7 (depends on 1) The light-emitting element of claim 1, further comprising: a contact hole penetrating the light-emitting structure and the insulating pattern, wherein the second pattern comprises a first region which contacts the light-emitting structure and the second pattern further comprises a second region which contacts one of the conductive regions through the contact hole. ### Claim 8 (depends on 7) The light-emitting element of claim 7, wherein at least part of the first region and at least part of the second region are formed in the same plane. ### Claim 9 (depends on 7) The light-emitting element of claim 7, wherein the first region and the second region are bonded respectively to the first wiring pattern and the second wiring pattern by flip-chip bonding. ### Claim 10 (depends on 1) The light-emitting element of claim 1, further comprising: a first electrode connected to the first pattern and a second electrode connected to the second pattern. ### Claim 11 (depends on 10) The light-emitting element of claim 10, wherein the second pattern is wider than the first pattern. ### Claim 12 (depends on 1) The light-emitting structure of claim 1, wherein the first semiconductor pattern extends into the non-conductive regions. ### Claim 13 (depends on 1) The light-emitting element of claim 1, wherein the second pattern extends to a lower portion of the insulating regions. ### Claim 14 (depends on 1) The light-emitting element of claim 1, further comprising: a bonding pad on the second pattern. ### Claim 15 (depends on 1) The light-emitting element of claim 1, wherein the non-insulating regions are aligned with the corresponding non-conductive regions. ### Claim 16 (depends on 1) The light-emitting element of claim 1, wherein, the conductive regions and non-conductive regions alternate in a horizontal direction, and the second pattern formed in the non-insulating regions is aligned with the non-conductive regions. ### Claim 17 (depends on 1) The light-emitting element of claim 1, wherein edges of the first semiconductor pattern, the light-emitting pattern and the second semiconductor pattern have a continuing angular slope. ### Claim 18 (depends on 1) The light-emitting element of claim 1, wherein a first contacting surface of the light emitting pattern contacts an entirety of a contacting surface of the first semiconductor pattern and a second contacting surface of the light emitting pattern contacts an entirety of a contacting surface of the second semiconductor pattern. ### Claim 19 (depends on 1) The light-emitting element of claim 1, wherein a first surface of the light emitting pattern is the same length as a surface of the first semiconductor pattern and a second surface of the light emitting pattern is the same length as a surface of the second semiconductor pattern.