# US 8,569,770 B2 · Light emitting device package

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- Number: US 8,569,770 B2
- Document ID: US8569770B2
- Status: Granted
- Kind: B2
- Application number: 13/719,666
- Filed: 2012-12-19
- Published: 2013-05-02
- Granted: 2013-10-29
- Earliest claimed: 2009-02-23
- Assignees: LG Innotek Co., Ltd.
- Applicants: LG Innotek Co., Ltd.
- Inventors: Bum Chul Cho
- Web page: https://patentgrep.com/patent/US8569770B2

## CPC

- H10H 20/8506: {Containers}
- F21V 29/70: characterised by passive heat-dissipating elements, e.g. heat-sinks
- H10H 20/832: characterised by their material
- H10H 20/8582: {characterised by their shape}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/8583: {not being in contact with the bodies}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR

## Abstract

A light emitting device package including a substrate; a light emitting device on the substrate; a first heatsink between the substrate and the light emitting device to transfer heat generated from the light emitting device; a second heatsink disposed below the first heatsink; and an electrode between the first heat sink and the light emitting device. Further, the substrate is disposed between the first and second heatsinks and is narrower at a position between the first and second heatsinks than at a position not between the first and second heatsinks, a material of the substrate is the same at the position between the first and second heatsinks as not between the first and second heatsinks, and the substrate at the position not between the first and second heatsinks surrounds the first and second heat sinks.

## Claims

### Claim 1

A light emitting device package comprising:
a substrate;
a light emitting device on the substrate;
a first metal material between the substrate and the light emitting device;
a second metal material disposed below the first metal material; and
an electrode between the first metal material and the light emitting device,
wherein the substrate is disposed between the first and second metal materials and is narrower at a position between the first and second metal materials than at a position not between the first and second metal materials,
wherein a material of the substrate is the same at the position between the first and second metal materials as not between the first and second metal materials, and
wherein the substrate at the position not between the first and second metal materials surrounds the first and second metal materials.

### Claim 2 (depends on 1)

The light emitting device package according to claim 1, wherein the second metal material comprises copper.

### Claim 3 (depends on 1)

The light emitting device package according to claim 1, wherein the substrate comprises a silicon substrate, and the insulating layer comprises a silicon oxide layer.

### Claim 4 (depends on 1)

The light emitting device package according to claim 1, wherein the first and second metal materials at least partially overlap each other.

### Claim 5 (depends on 1)

The light emitting device package according to claim 1, wherein the second metal material comprises aluminum.

### Claim 6 (depends on 1)

The light emitting device package according to claim 1, wherein a distance between the first metal material and the second metal material ranges from 10 μm to 20 μm.

### Claim 7 (depends on 1)

The light emitting device package according to claim 1, wherein the substrate between the first metal material and the second metal material has a thickness corresponding to 1.25% to 5% of a maximum thickness of the substrate.

### Claim 8 (depends on 1)

The light emitting device package according to claim 1, wherein the electrode includes first and second electrodes separated from each other by a predetermined space.

### Claim 9 (depends on 8)

The light emitting device package according to claim 8, wherein one of the first and second electrodes contacts the first and second metal materials via a side surface of the substrate.

### Claim 10 (depends on 8)

The light emitting device package according to claim 8, wherein the predetermined space is shorter than a mounting width of the light emitting device.

### Claim 11 (depends on 8)

The light emitting device of claim 8, wherein the first electrode directly contacts the first metal material.

### Claim 12 (depends on 1)

The light emitting device package according to claim 1, wherein the substrate includes a first portion and a second portion extending laterally from the first portion.

### Claim 13 (depends on 12)

The light emitting device package according to claim 12, wherein the first portion of the substrate is at the position between the first and second metal materials and the second portion of the substrate is not at the position between the first and second metal materials.

### Claim 14 (depends on 1)

The light emitting device package according to claim 1, further comprising:
a phosphor layer around the light emitting device.

### Claim 15 (depends on 1)

The light emitting device package according to claim 1, wherein the first metal material comprises a first heat sink.

### Claim 16 (depends on 1)

The light emitting device package according to claim 1, wherein the second metal material comprises a second heat sink.