# US 8,569,699 B2 · Method for manufacturing MEMS device, method for manufacturing thermal detector, thermal detector, thermal detection device, and electronic instrument

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- Number: US 8,569,699 B2
- Document ID: US8569699B2
- Status: Granted
- Kind: B2
- Application number: 13/012,937
- Filed: 2011-01-25
- Published: 2011-07-28
- Granted: 2013-10-29
- Earliest claimed: 2010-01-27
- Assignees: Seiko Epson Corporation
- Applicants: Yasuhiko Murakami
- Inventors: Yasuhiko Murakami
- Web page: https://patentgrep.com/patent/US8569699B2

## CPC

- B81C 1/00523: {Etching material}
- G01J 5/024: {Special manufacturing steps or sacrificial layers or layer structures}
- G01J 5/10: using electric radiation detectors
- G01J 5/20: using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
- G01J 5/34: using capacitors, e.g. pyroelectric capacitors
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- G01J: MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY (light sources F21, H01J, H01K, H05B; investigating properties of materials by optical means G01N)

## Abstract

A method for manufacturing a MEMS device having an undercut shape formed on a fixed part includes a first step of forming an etching layer having a first cavity on the fixed part; a second step of forming a mask layer on a side wall of the etching layer, the side wall facing the first cavity; and a third step of directing an etchant fed into the first cavity on a surface side of the mask layer to a back surface side of the mask layer, isotropically etching the etching layer, forming a second cavity communicated with the first cavity on the back surface side of the mask layer, and processing the etching layer into an undercut shape.

## Claims

### Claim 1

A thermal detector comprising:
a fixed part;
a thermal detection element;
a support member having a first surface and a second surface which is opposite to the first surface, a cavity for thermal separation being formed between the first surface and the fixed part, and the support member supporting the thermal detection element on the second surface; and
a linking part linking the support member to the fixed part, the linking part being formed so that the cross-sectional area thereof is smaller on the side of the fixed part than on the side of the support member.

### Claim 2 (depends on 1)

The thermal detector according to claim 1, wherein
the support member includes
a mounting member supporting the thermal detection element, and
at least one arm extending toward a linked end part from a proximal end connected to the mounting member,
the linking part including a first linking part linking the fixed part and the linked end part of the at least one arm.

### Claim 3 (depends on 2)

The thermal detector according to claim 2, wherein
the first linking part is formed so that a second edge thereof adjacent to the fixed part side is shorter than a first edge adjacent to the linked end part side in a longitudinal section in the extension direction of the at least one arm.

### Claim 4 (depends on 3)

The thermal detector according to claim 3, wherein
a third edge connecting the first edge and the second edge and facing the cavity is curved in a longitudinal section of the first linking part.

### Claim 5 (depends on 3)

A thermal detection device comprising the thermal detector according to claim 3 arranged in two dimensions along two orthogonal axes.

### Claim 6 (depends on 5)

An electronic instrument characterized in comprising the thermal detection device according to claim 5.

### Claim 7 (depends on 3)

An electronic instrument comprising the thermal detector according to claim 3.

### Claim 8 (depends on 2)

The thermal detector according to claim 2, wherein
the linking part further includes a second linking part linking the support member and the fixed part at a position other than that of the linked end part, the second linking part being formed in a columnar shape within the cavity.

### Claim 9 (depends on 8)

The thermal detector according to claim 8, wherein
the shape of the longitudinal section of the second linking part has line symmetry about the longitudinal center line of the second linking part.

### Claim 10 (depends on 2)

The thermal detector according to claim 2, further comprising
a spacer member extending in a columnar shape within the cavity toward a free end part on the side of the fixed part from a proximal end on the side of the support member, at a position other than that of the linked end part,
a gap communicated with the cavity being formed between the fixed part and the free end part of the spacer member.

### Claim 11 (depends on 2)

A thermal detection device comprising the thermal detector according to claim 2 arranged in two dimensions along two orthogonal axes.

### Claim 12 (depends on 11)

An electronic instrument characterized in comprising the thermal detection device according to claim 11.

### Claim 13 (depends on 2)

An electronic instrument comprising the thermal detector according to claim 2.

### Claim 14 (depends on 1)

A thermal detection device comprising the thermal detector according to claim 1 arranged in two dimensions along two orthogonal axes.

### Claim 15 (depends on 14)

An electronic instrument characterized in comprising the thermal detection device according to claim 14.

### Claim 16 (depends on 1)

An electronic instrument comprising the thermal detector according to claim 1.
