# US 8,569,633 B2 · Feedthrough for microelectromechanical system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,569,633 B2 - Document ID: US8569633B2 - Status: Granted - Kind: B2 - Application number: 11/949,005 - Filed: 2007-11-30 - Published: 2008-11-20 - Granted: 2013-10-29 - Earliest claimed: 2006-11-30 - Assignees: Medtronic, Inc. - Applicants: Rogier Receveur; Michael A. Schugt; William J. Taylor; Brad C. Tischendorf - Inventors: Rogier Receveur; Michael A. Schugt; William J. Taylor; Brad C. Tischendorf - Web page: https://patentgrep.com/patent/US8569633B2 ## CPC - A61N 1/05: for implantation or insertion into the body, e.g. heart electrode (A61N1/06 takes precedence) - A61N 1/3754: {Feedthroughs} - A61N: ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY (measurement of bioelectric currents A61B; surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body A61B18/00; anaesthetic apparatus in general A61M; incandescent lamps H01K; infrared radiators for heating H05B) ## Abstract A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture, the feedthrough assembly comprises a conductive element housed in a glass insulator member. A second substrate is coupled to the first substrate. ## Claims ### Claim 1 A micro electromechanical system (MEMS) package for an implantable medical device comprising: a first substrate that includes a first surface, a second surface, and an aperture extending through the first substrate from the first surface to the second surface; a feedthrough assembly coupled to the aperture, the feedthrough assembly including a conductive element housed in a glass insulator member; a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate such that the first surface of the second substrate faces the second surface of the first substrate, further wherein the first substrate is coupled to the second substrate by joint material disposed on the first surface of the second substrate contacting the second surface of the first substrate, further wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device; and a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate. ### Claim 2 A micro electromechanical system (MEMS) package for an implantable medical device comprising: a first substrate that includes a first exterior surface, a second surface, and an aperture extending through the first substrate from the first exterior surface to the second surface; a feedthrough assembly comprising a ceramic insulator and a conductive element housed in the ceramic insulator member, the feedthrough assembly disposed in the aperture; a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate such that the first surface of the second substrate faces the second surface of the first substrate, wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device, a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate; and wherein no conductive material exists between the conductive element and the first substrate. ### Claim 3 (depends on 2) The MEMS package of claim 2, wherein the ceramic insulator member comprises a material having a CTE similar to a CTE of the first substrate. ### Claim 4 (depends on 2) The MEMS package of claim 2, wherein the ceramic insulator member comprises a material having a CTE similar to a CTE of the second substrate. ### Claim 5 (depends on 2) The MEMS package of claim 2, wherein a metallized trace is disposed in a first surface of the second substrate. ### Claim 6 (depends on 2) The MEMS package of claim 2, wherein the conductive element includes at least one of Ta, Nb, Ti, Pt, Ir and alloys thereof. ### Claim 7 A microelectromechanical system (MEMS) package for an implantable medical device comprising: a first substrate that includes a first exterior surface, a second surface, and an aperture extending through the first substrate from the first exterior surface to the second surface; a feedthrough assembly hermetically sealed in the aperture, the feedthrough assembly being exposed on an exterior surface of the first substrate, and wherein the feedthrough assembly includes: a glass insulator member sealed within the aperture; and a conductive pin extending through the insulator member; a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate such that the first surface of the second substrate faces the second surface of the first substrate, wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device; a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate; and wherein no conductive material exists between the conductive element and the first substrate. ### Claim 8 (depends on 7) The MEMS package of claim 7, wherein the glass insulator member comprises a material having a coefficient of thermal expansion (CTE) similar to a CTE of the first substrate. ### Claim 9 (depends on 8) The MEMS package of claim 8, wherein the glass insulator member comprises a material having a CTE within 2.5% of a CTE of the first substrate. ### Claim 10 (depends on 7) The MEMS package of claim 7, wherein the glass insulator member comprises a material having a CTE within 5% of a CTE of the first substrate. ### Claim 11 (depends on 7) The MEMS package of claim 7, wherein the glass insulator member comprises a material having a CTE within 10% of a CTE of the first substrate. ### Claim 12 (depends on 8) The MEMS package of claim 8, wherein the glass insulator member comprises a material having a CTE within 2.5% of a CTE of the second substrate. ### Claim 13 (depends on 7) The MEMS package of claim 7, wherein the glass insulator member comprises a material having a CTE within 5% of a CTE of the second substrate. ### Claim 14 (depends on 7) The MEMS package of claim 7, wherein the glass insulator member comprises a material having a CTE within 10% of a CTE of the second substrate. ### Claim 15 (depends on 7) The MEMS package of claim 7, wherein the conductive element includes at least one of tantalum (Ta), niobium (Nb), titanium (Ti), platinum (Pt), iridium (Ir) and alloys thereof. ### Claim 16 (depends on 7) The MEMS package of claim 7 wherein the glass insulator member comprises a material having a CTE similar to a CTE of the first substrate. ### Claim 17 (depends on 16) The MEMS package of claim 16, wherein the glass insulator member comprises a material having a CTE within 2.5% of a CTE of the first substrate. ### Claim 18 (depends on 16) The MEMS package of claim 16, wherein the glass insulator member comprises a material having a CTE within 5% of a CTE of the first substrate. ### Claim 19 (depends on 16) The MEMS package of claim 16, wherein the glass insulator member comprises a material having a CTE within 1% of a CTE of the first substrate. ### Claim 20 (depends on 7) The MEMS package of claim 7, wherein the second substrate includes a surface with a metalized trace disposed thereon, the metalized trace directly coupled to the conductive pin. ### Claim 21 A MEMS package for an implantable medical device comprising: a first substrate that includes a first exterior surface, a second surface, and an aperture extending through the first substrate from the first exterior surface to the second surface; a feedthrough assembly hermetically sealed in the aperture comprising: a glass insulator member sealed within the aperture; and a conductive pin extending through glass insulator member; a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate such that the first surface of the second substrate faces the second surface of the first substrate, further wherein the first is coupled to the second substrate by joint material located between the second surface of the first substrate and the first surface of the second substrate, further wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device; a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate; and wherein no conductive material exists between the conductive element and the first substrate. ### Claim 22 A microelectromechanical system (MEMS) package for an implantable medical device comprising: a first substrate that includes a first exterior surface, a second surface, and an aperture extending through the first substrate from the first exterior surface to the second surface; a feedthrough assembly hermetically sealed in the aperture comprising: a glass insulator member sealed within the aperture; and a conductive pin extending through glass insulator member; a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate by joint material located between the second surface of the first substrate and the first surface of the second substrate such that the first surface of the second substrate faces the second surface of the first substrate, wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device; a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate; and wherein no conductive material exists between the conductive element and the first substrate. ### Claim 23 (depends on 22) The MEMS package of claim 22, wherein the first substrate comprises one of polycrystalline alumina and single crystal alumina. ### Claim 24 A microelectromechanical system (MEMS) package for an implantable medical device comprising: a first substrate that includes a first exterior surface, a second surface, and an aperture extending through the first substrate from the first exterior surface to the second surface; a feedthrough assembly hermetically sealed in the aperture, the feedthrough assembly being exposed on the second surface of the first substrate, and wherein the feedthrough assembly includes: a glass insulator member sealed within the aperture; and a conductive pin extending through the insulator member; a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate such that the first surface of the second substrate faces the second surface of the first substrate, further wherein the first substrate is coupled to the second substrate by joint material located between the second surface of the first substrate and the first surface of the second substrate, further wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device; a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate; and wherein no conductive ferrule exists between the conductive element and the first substrate. ### Claim 25 A MEMS package for an implantable medical device comprising: a first substrate that includes a first exterior surface, a second surface, and an aperture extending through the first substrate from the first exterior surface to the second surface; a feedthrough assembly hermetically sealed in the aperture, the feedthrough assembly including a conductive element housed solely in a glass insulator member; a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate such that the first surface of the second substrate faces the second surface of the first substrate, further wherein the first substrate is coupled to the second substrate by joint material located between the second surface of the first substrate and the first surface of the second substrate, further wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device; a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate; wherein the first substrate comprises glass, and wherein no conductive material exists between the conductive element and the first substrate. ### Claim 26 A MEMS package for an implantable medical device comprising: a first substrate that includes a first exterior surface, a second surface, and an aperture extending through the first substrate from the first exterior surface to the second surface; a feedthrough assembly hermetically sealed in the aperture, the feedthrough assembly including a conductive element housed solely in a glass insulator member; and a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate such that the first surface of the second substrate faces the second surface of the first substrate, wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device; a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate; and wherein the first substrate comprises glass, and wherein no conductive ferrule exists between the conductive element and the first substrate.