# US 8,569,404 B2 · Polyamide resin composition and molded article > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,569,404 B2 - Document ID: US8569404B2 - Status: Granted - Kind: B2 - Application number: 13/322,499 - Filed: 2010-05-28 - Published: 2012-03-15 - Granted: 2013-10-29 - Earliest claimed: 2009-05-28 - Assignees: Mitsubishi Gas Chemical Company, Inc. - Applicants: Shun Ogawa; Takahiko Sumino - Inventors: Shun Ogawa; Takahiko Sumino - Web page: https://patentgrep.com/patent/US8569404B2 ## CPC - C08L 77/06: Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) - C08G 69/26: derived from polyamines and polycarboxylic acids - C08K 5/0008: {Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59} - C08K 5/18: with aromatically bound amino groups - C08K 5/372: Sulfides {, e.g. R-(S)x-R'} - C08K 5/378: containing heterocyclic rings - C08K 5/39: Thiocarbamic acids; Derivatives thereof, e.g. dithiocarbamates - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract Disclose is a polyamide resin composition having excellent heat resistance, heat aging resistance and mechanical physical properties, which is produced by incorporating a specified aromatic secondary amine compound and a specified organic sulfur based compound into a polyamide composed of a diamine unit containing a paraxylylenediamine unit as a major component and a dicarboxylic acid unit containing a linear aliphatic dicarboxylic acid unit having from 6 to 18 carbon atoms as a major component. ## Claims ### Claim 1 A polyamide resin composition, comprising: (A) a polyamide comprising (a1) a diamine unit comprising 70% by mole or more of (a1i) a paraxylylenediamine unit and (a2) a dicarboxylic acid unit comprising 70% by mole or more of (a2i) a linear aliphatic dicarboxylic acid unit comprising from 6 to 18 carbon atoms; (B) an aromatic secondary amine compound; and (C) an organic sulfur comprising compound, wherein the polyamide resin composition comprises from 0.05 to 5 parts by mass of the aromatic secondary amine compound (B) and from 0.05 to 5 parts by mass of the organic sulfur based compound (C) based on 100 parts by mass of the polyamide (A). ### Claim 2 (depends on 1) The composition of claim 1, wherein the linear aliphatic dicarboxylic acid (a2i) is at least one member selected from the group consisting of azelaic acid, sebacic acid, undecane diacid, and dodecane diacid. ### Claim 3 (depends on 1) The composition of claim 1, wherein the linear aliphatic dicarboxylic acid (a2i) is at least one member selected from the group consisting of sebacic acid and azelaic acid. ### Claim 4 (depends on 1) The composition of claim 1, wherein the aromatic secondary amine compound (B) is at least one selected from the group consisting of a compound having a diphenylamine skeleton, a compound having a phenylnaphthylamine skeleton, and a compound having a dinaphthylamine skeleton. ### Claim 5 (depends on 1) The composition of claim 1, wherein the aromatic secondary amine compound (B) is at least one selected from the group consisting of N,N′-di-2-naphthyl-p-phenylenediamine, N,N′-diphenyl-p-phenylenediamine, and 4,4′-bis(α,α-dimethylbenzyl)diphenylamine. ### Claim 6 (depends on 1) The composition of claim 1, wherein the organic sulfur comprising compound (C) is at least one selected from the group consisting of a mercaptobenzoimidazole comprising compound, a dithiocarbamic acid comprising compound, a thiourea comprising compound, and an organic thio acid comprising compound. ### Claim 7 (depends on 1) The composition of claim 1, wherein the organic sulfur comprising compound (C) is at least one selected from the group consisting of 2-mercaptobenzoimidazole, 2-mercaptomethylbenzimidazole, dimyristyl-3,3′-thiodipropionate, distearyl-3,3′-thiodipropionate, and pentaerythritol tetrakis(3-laurylthiopropionate). ### Claim 8 (depends on 1) A molded article, comprising the composition of claim 1. ### Claim 9 (depends on 8) The article of claim 8, which is prepared by injection molding. ### Claim 10 (depends on 8) The article of claim 8, which is prepared by extrusion molding. ### Claim 11 (depends on 8) The article of claim 8, which is prepared by compression molding. ### Claim 12 (depends on 1) The composition of claim 1, wherein the linear aliphatic dicarboxylic acid (a2i) comprises sebacic acid. ### Claim 13 (depends on 1) The composition of claim 1, wherein the linear aliphatic dicarboxylic acid (a2i) comprises azelaic acid. ### Claim 14 (depends on 1) The composition of claim 1, wherein the aromatic secondary amine compound (B) comprises N,N′-di-2-naphthyl-p-phenylenediamine. ### Claim 15 (depends on 1) The composition of claim 1, wherein the aromatic secondary amine compound (B) comprises N,N′-diphenyl-p-phenylenediamine. ### Claim 16 (depends on 1) The composition of claim 1, wherein the aromatic secondary amine compound (B) comprises 4,4′-bis(α,α-dimethylbenzyl)diphenylamine. ### Claim 17 (depends on 2) The composition of claim 2, wherein the aromatic secondary amine compound (B) is at least one selected from the group consisting of a compound having a diphenylamine skeleton, a compound having a phenylnaphthylamine skeleton, and a compound having a dinaphthylamine skeleton. ### Claim 18 (depends on 2) The composition of claim 2, wherein the organic sulfur comprising compound (C) is at least one selected from the group consisting of a mercaptobenzoimidazole comprising compound, a dithiocarbamic acid comprising compound, a thiourea comprising compound, and an organic thio acid comprising compound. ### Claim 19 (depends on 17) The composition of claim 17, wherein the organic sulfur comprising compound (C) is at least one selected from the group consisting of a mercaptobenzoimidazole comprising compound, a dithiocarbamic acid comprising compound, a thiourea comprising compound, and an organic thio acid comprising compound. ### Claim 20 (depends on 1) The composition of claim 1, wherein the organic sulfur comprising compound (C) comprises a mercaptobenzoimidazole comprising compound.