Superconducting wire
AssigneeKorea Electrotechnology Research Institute
InventorsHong Soo Ha, Sang Soo Oh, Seok Ho Kim, Gi Deok Shim
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Abstract
Disclosed herein is a superconducting wire which is used in, for example, superconducting magnet energy storage systems. The superconducting wire includes: a wire comprising a metal substrate, a superconducting layer and a buffer interposed between the metal substrate and the superconducting layer; and a stabilizer layer plated on the wire, wherein an epoxy resin insulating layer coats the entire surface of the stabilizer layer. The superconducting wire makes it possible to reduce damage to an insulating material when forming the insulating material during the production of the superconducting wire, and it has a uniform surface and can be produced in a simple manner.
Claims5
A superconducting wire comprising:
- a metal substrate;
- a superconducting layer;
- a buffer interposed between the metal substrate and the superconducting layer;
- a pair of first stabilizer layers, wherein one of the stabilizer layers is disposed on an outer face of the metal substrate and one of the stabilizer layers is disposed on an outer face of the superconducting layer;
- a second stabilizer layer enclosing an entire outer exposed surface of the metal substrate, the superconducting layer, the buffer, and the pair of first stabilizer layers;
- an epoxy resin insulating layer enclosing an entire outer exposed surface of the second stabilizer layer;
- and
- a conductive layer disposed on an outer face of the epoxy resin insulating layer,
- wherein the epoxy resin insulating layer includes a connection hole formed therein, and wherein the conductive layer is filled in the connection hole such that the second stabilizer layer is electrically connected with the conductive layer through the conductive layer filled in the connection hole.
A superconducting wire comprising:
- a metal substrate;
- a superconducting layer;
- a buffer interposed between the metal substrate and the superconducting layer;
- a pair of first stabilizer layers, wherein one of the stabilizer layers is disposed on an outer face of the metal substrate and one of the stabilizer layers is disposed on an outer face of the superconducting layer
- a second stabilizer layer enclosing an entire outer exposed surface of the metal substrate, the superconducting layer, the buffer, and the pair of first stabilizer layers;
- an epoxy resin insulating layer enclosing an entire outer exposed surface of the second stabilizer layer;
- and
- a plurality of conductive layers disposed on an outer face of the epoxy resin insulating layer, the conductive layers spaced apart from and disposed in parallel relation to one another,
- wherein the epoxy resin insulating layer includes a plurality of connection holes formed at locations overlaying the plurality of conductive layers, and wherein the conductive layers are filled in the connection holes such that the second stabilizer layer is electrically connected with the plurality of conductive layers through the conductive layers filled in the connection holes.
Dependencies are inferred from the claim text.