# US 8,569,185 B2 · Method of fabricating gate electrode using a treated hard mask

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- Number: US 8,569,185 B2
- Document ID: US8569185B2
- Status: Granted
- Kind: B2
- Application number: 12/700,862
- Filed: 2010-02-05
- Published: 2011-08-11
- Granted: 2013-10-29
- Earliest claimed: 2010-02-05
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Matt Yeh; Hui Ouyang; Han-Pin Chung; Shiang-Bau Wang
- Inventors: Matt Yeh; Hui Ouyang; Han-Pin Chung; Shiang-Bau Wang
- Web page: https://patentgrep.com/patent/US8569185B2

## CPC

- H10D 84/038: {using silicon technology, e.g. SiGe}
- H10D 30/0275: {forming single crystalline semiconductor source or drain regions resulting in recessed gates, e.g. forming raised source or drain regions}
- H10D 30/608: {having non-planar bodies, e.g. having recessed gate electrodes}
- H10D 30/797: {being in source or drain regions, e.g. SiGe source or drain}
- H10D 62/371: {Inactive supplementary semiconductor regions, e.g. for preventing punch-through, improving capacity effect or leakage current}
- H10D 62/822: comprising only Group IV materials heterojunctions, e.g. Si/Ge heterojunctions
- H10D 84/0167: {Manufacturing their channels}
- H10D 84/017: {Manufacturing their source or drain regions, e.g. silicided source or drain regions}
- H10D 84/0172: {Manufacturing their gate conductors}
- H10P 30/222: {characterised by the angle between the ion beam and the crystal planes or the main crystal surface (characterised by the angle between the ion beam and the mask H10P30/221)}
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A method for fabricating an integrated device is disclosed. In an embodiment, a hard mask layer with a limited thickness is formed over a gate electrode layer. A treatment is provided to the hard mask layer to make the hard mask layer more resistant to a wet etch solution. Then, a patterning is provided on the treated hard mask layer and the gate electrode to from a gate structure.

## Claims

### Claim 1

A method of fabricating an integrated circuit device, the method comprising:
providing a substrate;
forming a polysilicon material layer over the substrate;
forming a hard mask layer over the polysilicon material layer;
providing a treatment to the hard mask layer to introduce species therein, wherein the species has an atomic number less than about 50, wherein the species is introduced by an ion implantation that is performed with a dose of less than or equal to about 1E14 atoms/cm2;
patterning the treated hard mask layer; and
patterning the polysilicon material layer with the patterned treated hard mask layer.

### Claim 2 (depends on 1)

The method of claim 1, wherein the hard mask layer is a silicon oxide layer.

### Claim 3 (depends on 1)

The method of claim 1, wherein the hard mask layer has a thickness less than or equal to approximately 800 Angstroms.

### Claim 4 (depends on 1)

The method of claim 1, further comprising a step of providing a thermal anneal to the hard mask layer.

### Claim 5 (depends on 4)

The method of claim 4, wherein a temperature of the thermal anneal is between about 750° C. and about 1100° C.

### Claim 6 (depends on 4)

The method of claim 4, wherein a duration of the thermal anneal is between about 0.1 sec and about 1800 sec.

### Claim 7 (depends on 1)

The method of claim 1, wherein the species is at least one of boron, carbon, fluorine, or nitrogen.

### Claim 8 (depends on 1)

The method of claim 1, wherein the species is introduced by an ion implantation that is performed at an energy higher than or equal to approximately 10 KeV.

### Claim 9 (depends on 1)

The method of claim 1, further comprising a step of forming LDD regions in the substrate by an implantation process utilizing a tilt-angle of between about 25° and about 30°.

### Claim 10

A method comprising:
providing a substrate;
forming a gate electrode layer over the substrate, the gate electrode layer including polysilicon;
forming a hard mask layer over the gate electrode layer;
heating the hard mask layer to form a heated hard mask layer;
ion implanting the heated hard mask layer to form a treated hard mask layer, wherein ion implanting the heated hard mask includes implanting a species selected from the group consisting of fluorine, nitrogen, phosphorous, arsenic, and indium into the heated hard mask layer;
patterning the treated hard mask layer and the gate electrode layer to form a gate structure of a PMOS device and a gate structure of an NMOS device;
forming n-type strained source/drain regions in the substrate, wherein the n-type strained source/drain regions are adjacent to the edges of the gate structure of NMOS device;
forming p-type strained source/drain regions in the substrate, wherein the p-type strained source/drain regions are adjacent to the edges of the gate structure of PMOS device;
forming n-type lightly-doped source/drain regions in the n-type strained source/drain regions by a first tilt-angle ion implantation; and
forming p-type lightly-doped source/drain regions in the p-type strained source/drain regions by a second tilt-angle ion implantation.

### Claim 11 (depends on 10)

The method of claim 10, wherein an etch rate of the treated hard mask layer in a 1/100 diluted by volume of liquid hydrofluoric acid solution at room temperature is less than 40 A/min.

### Claim 12 (depends on 10)

The method of claim 10, wherein the implanting the species occurs with a dose of less than or equal to about 1E14 atoms/cm2.

### Claim 13 (depends on 10)

The method of claim 10, forming a p-type halo pocket region under a sidewall spacer of the gate structure of the NMOS device.

### Claim 14 (depends on 13)

The method of claim 13, wherein a first edge of the p-type halo pocket region is aligned with an outer edge of the sidewall spacer and a second edge of the p-type halo pocket region is aligned with an inner edge of the sidewall spacer.

### Claim 15

A method comprising:
providing a substrate;
forming a gate electrode material layer over the substrate;
forming a hard mask layer over the gate electrode material layer;
performing an ion implantation process on the hard mask layer to introduce ion species therein, wherein the species has an atomic number less than about 50, wherein the species is introduced by an ion implantation that is performed with a dose of less than or equal to about 1E14 atoms/cm2; and
patterning the hard mask and the gate electrode material layer to form a gate stack.

### Claim 16 (depends on 15)

The method of claim 15, wherein the gate electrode material layer includes polysilicon.

### Claim 17 (depends on 15)

The method of claim 15, wherein the hard mask layer includes silicon.

### Claim 18 (depends on 15)

The method of claim 15, wherein the ion species includes at least one of boron, fluorine, arsenic, or indium.

### Claim 19 (depends on 15)

The method of claim 15, further comprising performing a first annealing process on the hard mask layer prior to performing the ion implantation process.

### Claim 20 (depends on 19)

The method of claim 19, further comprising performing a second annealing process on the hard mask layer after performing the ion implantation process and before the patterning the hard mask and the gate electrode material layer to form the gate stack.