# US 8,569,110 B2 · Pre-bonded substrate for integrated circuit package and method of making the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,569,110 B2 - Document ID: US8569110B2 - Status: Granted - Kind: B2 - Application number: 13/111,982 - Filed: 2011-05-20 - Published: 2012-06-14 - Granted: 2013-10-29 - Earliest claimed: 2010-12-09 - Assignees: QPL Limited - Applicants: John Robert McMillan; Xiao Yun Chen; Tung Lok Li - Inventors: John Robert McMillan; Xiao Yun Chen; Tung Lok Li - Web page: https://patentgrep.com/patent/US8569110B2 ## CPC - H10W 70/424: {Cross-sectional shapes (H10W70/481 takes precedence)} - H10W 70/042: {Etching} - H10W 70/457: {of metallic layers on leadframes} - H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers} - H10W 72/075: {of bond wires} - H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - Y10T 156/10: Methods of surface bonding and/or assembly therefor - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A substrate and a method of making thereof are disclosed. The substrate comprises an electrically conductive leadframe, the leadframe having a plurality of lands on a first side of the leadframe with a first recessed portion between the lands, and a plurality of routing leads on an opposing second side of the leadframe with a second recessed portion between the routing leads. The substrate also comprises a first bonding compound filling the first recessed portion. In one embodiment, the substrate also comprises a support material attached to the first bonding compound for holding the leadframe together. In another embodiment, the substrate comprises a second bonding compound filling the second recessed portion. ## Claims ### Claim 1 A method of manufacturing a substrate for an integrated circuit package, comprising the steps of: a) patterning a leadframe on a first side forming a plurality of lands and a first recessed portion between said plurality of lands; b) disposing a first bonding compound on said first side of said leadframe, said first bonding compound having a first portion filling said first recessed portion; c) patterning said leadframe on an opposing second side forming a plurality of electrically isolated routing leads and a second recessed portion between said plurality of routing leads; d) disposing a second bonding compound on said second side of said leadframe filling at least a portion of said second recessed portion; and e) disposing a plurality of bonding pads on said plurality of routing leads; whereby said first bonding compound prevents displacement of said plurality of routing leads; and combination of said first bonding material and said second bonding material hold metal features in place during assembly processes of die attach, die to substrate interconnection and encapsulation molding. ### Claim 2 (depends on 1) The method according to claim 1, wherein a lateral extent of said plurality of bonding pads is larger than the size of at least one semiconductor die adapted to attached thereto. ### Claim 3 (depends on 1) The method according to claim 1, wherein said first bonding compound is an epoxy with a coefficient of thermal expansion between 7 and 15. ### Claim 4 (depends on 1) The method according to claim 1, wherein said first bonding compound is an engineered epoxy, a thermoset or a thermoplastic compound. ### Claim 5 (depends on 1) The method according to claim 1, wherein said second bonding compound has a coefficient of thermal expansion between that of said first bonding compound and a semiconductor die adapted to attach thereto. ### Claim 6 (depends on 1) The method according to claim 1, wherein said second bonding compound further covers said routing leads, said method further comprises a step of selectively removing said second bonding compound to expose said routing leads. ### Claim 7 (depends on 1) The method according to claim 1, further comprising a step of attaching a support material on said first side of said leadframe, said support material attached to and supporting said plurality of lands, wherein a plurality of solder pads is disposed on said plurality of lands before said step of attaching said support material, such that said support material further covers said plurality of solder pads. ### Claim 8 (depends on 1) The method according to claim 1, wherein said first bonding compound further comprises a second portion extending over said first recessed portion and said leadframe, covering said plurality of lands. ### Claim 9 (depends on 1) The method according to claim 1, further comprising a step of selectively disposing a non-conductive die attach material onto said routing leads within a predetermined area of said second side of said leadframe. ### Claim 10 (depends on 1) The method according to claim 1, further comprising a step of selectively disposing a non-conductive die attach material onto a predetermined area of said second side of said leadframe, said non-conductive die attach material being disposed on said routing leads within said predetermined area and also filling said second recessed portion between said routing leads within said predetermined area. ### Claim 11 (depends on 1) The method according to claim 1, wherein said patterning a leadframe on a first side step further forms a support ring surrounding each individual unit in said leadframe. ### Claim 12 (depends on 1) The method according to claim 1, wherein said at least one of said first bonding compound and second bonding compound is made of a photolithographic material. ### Claim 13 (depends on 1) The method according to claim 1, wherein said first bonding compound is made of an epoxy material and said second bonding compound is made of a photolithographic material. ### Claim 14 (depends on 1) The method according to claim 1, wherein a lateral extend of at least one of said plurality of routing leads is disposed between said plurality of lands and is connected to said land laterally disposed. ### Claim 15 (depends on 1) The method according to claim 1, wherein said patterning a leadframe on a first side step further forms a support ring surrounding each individual package site in a substrate strip with said support ring having no connection to any of said metal features within said individual package site and said method further comprise a step of removing said support ring from said substrate. ### Claim 16 (depends on 1) The method according to claim 1, wherein said second bonding compound is first disposed filling said second recessed portions and covering said routing leads, and then selectively removed to expose said routing leads. ### Claim 17 A method of manufacturing an integrated circuit package, comprising the steps of: a) providing a substrate comprising the steps of: i patterning a leadframe on a first side forming a plurality of lands and a first recessed portion between said plurality of lands; ii disposing a first bonding compound on said first side leadframe, said first bonding compound having a first portion filling said first recessed portion; iii patterning said leadframe on an opposing second side forming a plurality of electrically isolated routing leads and a second recessed portion between said plurality of routing leads; and iv disposing a plurality of bonding pads on said plurality of routing leads; whereby said first bonding compound prevents displacement of said plurality of routing leads; b) attaching at least one semiconductor die onto said second side of said substrate; c) electrically connecting said semiconductor die to said plurality of bonding pads through bonding wires; and d) encapsulating said semiconductor die, said bonding wires and said substrate on said second side. ### Claim 18 (depends on 17) The method according to claim 17 further comprising a step of disposing a second bonding compound on said second side of said leadframe, said second bonding compound filling said second recessed portion. ### Claim 19 (depends on 18) The method according to claim 18, wherein said at least one of said first bonding compound and second bonding compound is made of a photolithographic material. ### Claim 20 (depends on 18) The method according to claim 18, wherein said first bonding compound is made of an epoxy material and said second bonding compound is made of a photolithographic material. ### Claim 21 (depends on 18) The method according to claim 18, further comprising a conductive die attach material selectively disposed over said second bonding material within a predetermined area of said second side of said leadframe. ### Claim 22 (depends on 17) The method according to claim 17, further comprising a step of attaching a support material on said first side of said substrate, said support material attached to and supporting said plurality of lands; wherein said support material is de-attached from said substrate after said encapsulating step. ### Claim 23 (depends on 17) The method according to claim 17, wherein said first bonding compound further comprises a second portion extending over said first portion and said leadframe, covering said plurality of lands, said method further comprises a step of selectively removing said first bonding compound such that said second portion is removed while said first portion remains disposed on said leadframe. ### Claim 24 (depends on 17) The method according to claim 17, further comprising a step of selectively disposing a non-conductive die attach material onto said routing leads within a predetermined area of said second side of said substrate. ### Claim 25 (depends on 17) The method according to claim 17, further comprising a step of selectively disposing a non-conductive die attach material onto a predetermined area of said second side of said leadframe, said non-conductive die attach material being disposed on said routing leads within said predetermined area and also filling said second recessed portion between said routing leads within said predetermined area. ### Claim 26 (depends on 17) The method according to claim 17, wherein a lateral extent of said plurality of bonding pads is larger than the size of said semiconductor die. ### Claim 27 (depends on 17) The method according to claim 17, wherein said first bonding compound has a coefficient of thermal expansion between 7 and 15. ### Claim 28 (depends on 17) The method according to claim 17, wherein said patterning a leadframe on a first side step further forms a support ring surrounding each individual unit in said leadframe, said method further comprise a step of removing said support ring from said leadframe after said encapsulated step. ### Claim 29 (depends on 17) The method according to claim 17, wherein a lateral extent of at least one of said plurality of routing leads is disposed between two land features and is connected to said land laterally disposed. ### Claim 30 (depends on 17) The method according to claim 17, wherein said first patterning step further forms a support ring surrounding each individual package site in a substrate strip with said support ring having no connection to any metal features within said individual package site and said method further comprises step of removing said support ring from said substrate. ### Claim 31 A method of manufacturing a substrate for an integrated circuit package, comprising the steps of: a) patterning a leadframe on a first side forming a plurality of lands, a first recessed portion between said plurality of lands, and a support ring surrounding each individual unit in said leadframe; b) disposing a first bonding compound on said first side of said leadframe, said first bonding compound having a first portion filling said first recessed portion; c) patterning said leadframe on an opposing second side forming a plurality of routing leads, a second recessed portion between said plurality of routing leads, at least one said routing lead comprising a tie bar connecting said routing lead to said support ring; d) disposing a second bonding compound on said second side of said leadframe filling at least a portion of said second recessed portion; and e) disposing a plurality of bonding pads on said plurality of routing leads; whereby said first bonding compound and said tie bar prevents displacement of said plurality of routing leads; and combination of said first bonding material and said second bonding material hold metal features in place during assembly processes of die attach, die to substrate interconnection and encapsulation molding. ### Claim 32 (depends on 31) The method according to claim 31, wherein said first bonding compound is made of an epoxy material and said second bonding compound is made of a photolithographic material.