Back to results
US 8,569,109 B2Granted
Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module
AssigneeInfineon Technologies AG
InventorsManfred Mengel, Joachim Mahler, Khalil Hosseini, Horst Theuss
Life of this patent
Estimating the term…
Abstract
A method for attaching a metal surface to a carrier is provided, the method including: depositing a porous layer over at least one of a metal surface and a side of a carrier; and attaching the at least one of a metal surface and a side of a carrier to the porous layer by bringing a material into pores of the porous layer, resulting in the material forming an interconnection between the metal surface and the carrier.
Claims29
A method for attaching a metal surface to a carrier, the method comprising:
- depositing a porous layer over at least one of a metal surface and a side of a carrier;
- disposing the metal surface and the side of the carrier to face each other with the porous layer disposed between the metal surface and the side of the carrier;
- and
- bringing a material into pores of the porous layer such that at least a portion of the material and at least a portion of the porous layer are disposed between the metal surface and the side of the carrier, resulting in a composite of the material and the porous layer forming an interconnection from the metal surface to the carrier.
1 more element
A method for attaching a chip to a chip carrier, the method comprising:
- depositing a porous layer over at least one of a side of a chip and a side of a chip carrier;
- disposing the side of the chip and the side of the chip carrier to face each other with the porous layer disposed between the side of the chip and the side of the chip carrier;
- and
- bringing a material into pores of the porous layer such that at least a portion of the material and at least a portion of the porous layer are disposed between the metal surface and the side of the carrier, resulting in a composite of the material and the porous layer forming an interconnection from the chip to the chip carrier.
1 more element
A chip-packaging module comprising:
- a chip and a chip carrier;
- particles of at least one material configured to form a porous layer between facing sides of the chip and the chip carrier respectively, and
- at least one further material within the pores of the porous layer configured such that a composite of the porous layer and the further material forms an interconnection from the chip to the chip carrier;
- wherein at least a portion of the further material and at least a portion of said one material are disposed between the facing sides of the chip and the chip carrier respectively.
1 more element
A packaging module comprising:
- a structure comprising at least one metal surface;
- a carrier;
- particles of at least one material configured to form a porous layer between facing sides of the metal surface of the structure and the carrier respectively, and
- at least one further material within the pores of the porous layer configured such that a composite of the porous layer and the further material forms an interconnection from the metal surface of the structure to the carrier;
- wherein at least a portion of the further material and at least a portion of said one material are disposed between the facing sides of the chip and the chip carrier respectively.
2 more elements
A method for attaching a metal surface to a carrier, the method comprising:
- depositing a porous layer over at least one of a metal surface and a side of a carrier;
- disposing the metal surface and the side of the carrier to face each other with the porous layer disposed between the metal surface and the side of the carrier;
- and
- bringing a material into pores of the porous layer such that at least a portion of the material and at least a portion of the porous layer are disposed between the metal surface and the side of the carrier, resulting in the material forming an interconnection between the metal surface and the carrier;
- wherein depositing a porous layer over the at least one of a metal surface and a side of a carrier comprises depositing particles over the at least one of a metal surface and a side of a carrier, thereby forming pores of the porous layer;
- and
- wherein depositing particles over the at least one of a metal surface and a side of a carrier comprises depositing particles comprising an isolation material.
4 more elements
A method for attaching a metal surface to a carrier, the method comprising:
- depositing a porous layer over at least one of a metal surface and a side of a carrier;
- disposing the metal surface and the side of the carrier to face each other with the porous layer disposed between the metal surface and the side of the carrier;
- and
- bringing a material into pores of the porous layer such that at least a portion of the material and at least a portion of the porous layer are disposed between the metal surface and the side of the carrier, resulting in the material forming an interconnection between the metal surface and the carrier;
- wherein depositing a porous layer over the at least one of a metal surface and a side of a carrier comprises depositing particles over the at least one of a metal surface and a side of a carrier, thereby forming pores of the porous layer;
- and
- wherein forming pores of the porous layer comprises forming pores which are larger than about 50 nm.
4 more elements
A method for attaching a metal surface to a carrier, the method comprising:
- depositing a porous layer over at least one of a metal surface and a side of a carrier;
- disposing the metal surface and the side of the carrier to face each other with the porous layer disposed between the metal surface and the side of the carrier;
- and
- bringing a material into pores of the porous layer such that at least a portion of the material and at least a portion of the porous layer are disposed between the metal surface and the side of the carrier, resulting in the material forming an interconnection between the metal surface and the carrier;
- wherein depositing a porous layer over the at least one of a metal surface and a side of a carrier comprises depositing particles over the at least one of a metal surface and a side of a carrier, thereby forming pores of the porous layer;
- and
- wherein depositing particles over the at least one of a metal surface and a side of a carrier comprises depositing particles comprising an isolation material.
4 more elements
A method for attaching a chip to a chip carrier, the method comprising:
- depositing a porous layer over at least one of a side of a chip and a side of a chip carrier;
- disposing the side of the chip and the side of the chip carrier to face each other with the porous layer disposed between the side of the chip and the side of the chip carrier;
- and
- bringing a material into pores of the porous layer such that at least a portion of the material and at least a portion of the porous layer are disposed between the metal surface and the side of the carrier, resulting in the material forming an interconnection between the chip and the chip carrier;
- wherein depositing a porous layer over the at least one of a side of a chip and a side of a chip carrier comprises depositing particles over the at least one of a side of a chip and a side of a chip carrier hence forming pores of the porous layer;
- and
- wherein depositing particles over the at least one of a side of a chip and a side of a chip carrier comprises depositing particles having diameters ranging from about 200 nm to 40 μm.
4 more elements
Dependencies are inferred from the claim text.