Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
AssigneeIntel Corporation
InventorsDingying Xu, Leonel R. Arana, Nachiket R. Raravikar, Mohit Mamodia, Rajasekaran Swaminathan, Rahul Manepalli
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Abstract
A coating for a microelectronic device comprises a polymer film (131) containing a filler material (232). The polymer film has a thermal conductivity greater than 3 W/m·K and a thickness (133) that does not exceed 10 micrometers. The polymer film may be combined with a dicing tape (310) to form a treatment (300) that simplifies a manufacturing process for a microelectronic package (100) and may be used in order to manage a thermal profile of the microelectronic device.
Claims7
A treatment for a microelectronic device, the treatment comprising:
- a dicing tape;
- and
- a polymer film having a thermal conductivity greater than 3 W/m·K and a thickness that does not exceed 10 micrometers, wherein the polymer film comprises a first layer having a first thickness and a first filler content and a second layer having a second thickness and a second filler content;
- and
- the second filler content is greater than the first filler content.
A method of managing a thermal profile of a microelectronic die, the method comprising:
- applying a polymer film to a wafer containing the microelectronic die in such a way that the polymer film has a thickness that does not exceed 10 micrometers, the polymer film having a thermal conductivity greater than 3 W/m·K and comprising a first layer having a first thickness and a first filler content and a second layer having a second thickness and a second filler content that is greater than the first filler content;
- singulating the microelectronic die from the wafer;
- and
- attaching the microelectronic die to a package substrate.
Dependencies are inferred from the claim text.