Method for manufacturing photoelectric conversion device
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorShunpei Yamazaki
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AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorShunpei Yamazaki
Estimating the term…
A method for manufacturing a photoelectric conversion device including a first-conductivity-type crystalline semiconductor region, an intrinsic crystalline semiconductor region, and a second-conductivity-type semiconductor region that are stacked over an electrode is provided for a new anti-reflection structure. An interface between the electrode and the first-conductivity-type crystalline semiconductor region is flat. The intrinsic crystalline semiconductor region includes a crystalline semiconductor region, and a plurality of whiskers that are provided over the crystalline semiconductor region and include a crystalline semiconductor. The first-conductivity-type crystalline semiconductor region and the intrinsic crystalline semiconductor region are formed by a low pressure chemical vapor deposition method at a temperature higher than 550° C. and lower than 650° C. The second-conductivity-type semiconductor region is formed by a low pressure chemical vapor deposition method at a temperature lower than or equal to 550° C. or higher than or equal to 650° C.
A method for manufacturing a photoelectric conversion device, comprising the steps of:
A method for manufacturing a photoelectric conversion device, comprising the steps of:
A method for manufacturing a photoelectric conversion device, comprising the steps of:
A method for manufacturing a photoelectric conversion device, comprising the steps of:
Dependencies are inferred from the claim text.