Semiconductor device and method of dicing semiconductor devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJing-Cheng Lin, Chih-Wei Wu, Szu Wei Lu, Shin-Puu Jeng, Chen-Hua Yu
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Abstract
A method and apparatus for separating a substrate into individual dies and the resulting structure is provided. A modification layer, such as an amorphous layer, is formed within the substrate. A laser focused within the substrate may be used to create the modification layer. The modification layer creates a relatively weaker region that is more prone to cracking than the surrounding substrate material. As a result, the substrate may be pulled apart into separate sections, causing cracks the substrate along the modification layers. Dice or other components may be attached to the substrate before or after separation.
Claims18
A method for dicing a substrate, the method comprising:
- providing the substrate having at least two device regions separated by a dicing line, the substrate comprising a plurality of dice and an encapsulant between adjacent dice;
- forming a modification layer below a surface of the substrate along the dicing line;
- sawing partially through the encapsulant such that a layer of the encapsulant remains over an interconnect structure along the dicing line, thereby forming an indent in the encapsulant between adjacent dice;
- and
- pulling, after the sawing, the substrate in opposing directions such that the substrate separates into multiple pieces along the dicing line.
A method for dicing a substrate, the method comprising:
- providing the substrate having a plurality of dice mounted thereon, the plurality of dice having an encapsulant formed therebetween, the encapsulant having an indent between at least one adjacent pair of dice along a dicing line;
- forming a modification layer in the substrate beneath the encapsulant extending over the dicing line;
- and
- exerting opposing separating forces along the dicing line.
An electronic device comprising:
- a substrate, the substrate having a modification layer formed therein along an edge of the substrate, the modification layer not extending around a perimeter of the substrate, the substrate above and below the modification layer being unmodified as compared to an interior portion of the substrate;
- one or more dice attached to the substrate;
- and
- an encapsulant formed over the substrate alongside the one or more dice, the encapsulant extending laterally over the modification layer and to an edge of the substrate.
Dependencies are inferred from the claim text.