Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame
AssigneeTexas Instruments Incorporated
InventorsSteven A. Kummerl, Sreenivasan K Koduri
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Abstract
Various exemplary embodiments provide components, devices, and methods of semiconductor packaging. The disclosed packaging component can include a mold material disposed around a lead frame and at least an integrated circuit (IC), wherein the IC is electrically connected with one side of the lead frame. The opposite side of the lead frame including, for example, lead segments, can be exposed from the mold material. A variety of other components, devices, and packages can then be assembled, e.g., over the disclosed packaging component, through the exposed regions so as to improve packaging densities.
Claims9
A method for packaging comprising:
- connecting one or more components with a lead frame, wherein the one or more components comprise at least an integrated circuit;
- molding a mold material around the integrated circuit and the lead frame to form a packaging component, such that one or more external lead pins of the lead frame extend outside of the mold material for an external connection;
- and
- configuring the packaging component such that one or more lead segments of the lead frame are exposed from the mold material for a subsequent packaging in a vertical direction.
Dependencies are inferred from the claim text.