# US 8,569,080 B2 · Method for packaging light emitting diode > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,569,080 B2 - Document ID: US8569080B2 - Status: Granted - Kind: B2 - Application number: 13/523,878 - Filed: 2012-06-14 - Published: 2013-02-28 - Granted: 2013-10-29 - Earliest claimed: 2011-08-25 - Assignees: Advanced Optoelectronic Technology, Inc. - Applicants: Li-Hsiang Chen; Hsin-Chiang Lin; Pin-Chuan Chen - Inventors: Li-Hsiang Chen; Hsin-Chiang Lin; Pin-Chuan Chen - Web page: https://patentgrep.com/patent/US8569080B2 ## CPC - H10H 20/8582: {characterised by their shape} - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 3/0014: {Shaping of the substrate, e.g. by moulding} - H05K 2201/09036: Recesses or grooves in insulating substrate - H05K 2201/10106: Light emitting diode [LED] - H05K 2203/0278: Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A method of packaging a light emitting diode comprising: providing a flexible substrate with a heat-conducting layer, an insulating layer covering on a surface of the heat-conducting layer and an electrically conductive layer positioned on the insulating layer; etching the conductive layer to form a gap in the conductive layer and expose a part of the insulating layer, the conductive layer being separated by the gap into a first electrode and a second electrode isolated from each other; stamping the flexible substrate with a mold at the position of the gap to form a recess in the flexible substrate; positioning a light emitting element on the conductive layer and electrically connecting the light emitting element to the conductive layer; and forming an encapsulation to cover the light emitting element. ## Claims ### Claim 1 A method for packaging a light emitting diode comprising: providing a flexible substrate having a thickness in a range from 50 to 150 microns whereby the substrate is flexible, the flexible substrate comprising a heat-conducting layer, an insulating layer located on the heat-conducting layer and an electrically conductive layer positioned on the insulating layer; etching the conductive layer to form a gap and expose a part of the insulating layer, the conductive layer being divided by the gap into a first electrode and a second electrode isolated from each other; pressing the flexible substrate with a mold to form a recess in the substrate, wherein neighboring parts of the first electrode and the second electrode are pressed to be thinner and longer, and the gap is located below the recess; positioning a light emitting element in the recess, the light emitting element being located on the conductive layer and electrically connected to the first and second electrodes of the conductive layer; and forming an encapsulation in the recess to cover the light emitting element. ### Claim 2 (depends on 1) The method for packaging a light emitting diode according to claim 1, wherein the mold is shaped to have a shape of an inverted isosceles trapezoid with a top side thereof longer than a bottom side thereof. ### Claim 3 (depends on 2) The method for packaging a light emitting diode according to claim 2, wherein during the pressing process, a center of the mold is aligned with a center of the gap and the bottom side of the mold engages with the conductive layer. ### Claim 4 (depends on 3) The method for packaging a light emitting diode according to claim 3, wherein the pressing process is a hot pressing. ### Claim 5 (depends on 4) The method for packaging a light emitting diode according to claim 4, wherein the hot pressing is performed under 50 to 150 degrees centigrade. ### Claim 6 (depends on 3) The method for packaging a light emitting diode according to claim 3, wherein after the pressing process of the flexible substrate, the conductive layer, the insulating layer and the heat-conducting layer are partly deformed downwardly to form the recess. ### Claim 7 (depends on 3) The method for packaging a light emitting diode according to claim 3, wherein after the pressing process of the flexible substrate, the flexible substrate is symmetrical to the center of the gap. ### Claim 8 (depends on 3) The method for packaging a light emitting diode according to claim 3, wherein after the pressing process of the flexible substrate, each of the first and second electrodes is deformed to include a sidewall and a bottom wall, and the sidewall and the bottom wall are received in the recess. ### Claim 9 (depends on 8) The method for packaging a light emitting diode according to claim 8, wherein the sidewalls of the two electrodes are declined, and the bottom walls of the two electrodes are horizontal. ### Claim 10 (depends on 8) The method for packaging a light emitting diode according to claim 8, wherein the light emitting element is received in the recess and located at a bottom wall of one of the electrodes. ### Claim 11 (depends on 3) The method for packaging a light emitting diode according to claim 3, wherein after the pressing process of the flexible substrate, a middle portion of each of the insulating layer and the heat-conducting layer is pressed into a depressed shape. ### Claim 12 (depends on 1) The method for packaging a light emitting diode according to claim 1, wherein the encapsulation is formed by filling the encapsulation in the recess with a top surface of the encapsulation coplanar with top surfaces of the first electrode and the second electrode.