# US 8,568,906 B2 · Housing and method for making the same

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- Number: US 8,568,906 B2
- Document ID: US8568906B2
- Status: Granted
- Kind: B2
- Application number: 13/213,442
- Filed: 2011-08-19
- Published: 2012-07-05
- Granted: 2013-10-29
- Earliest claimed: 2011-01-05
- Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.; Hon Hai Precision Industry Co., Ltd.
- Applicants: Hsin-Pei Chang; Wen-Rong Chen; Huann-Wu Chiang; Cheng-Shi Chen; Yi-Chi Chan; Xiao-Qiang Chen
- Inventors: Hsin-Pei Chang; Wen-Rong Chen; Huann-Wu Chiang; Cheng-Shi Chen; Yi-Chi Chan; Xiao-Qiang Chen
- Web page: https://patentgrep.com/patent/US8568906B2

## CPC

- C23C 14/025: {Metallic sublayers}
- C23C 14/027: {Graded interfaces}
- C23C 14/0664: {Carbonitrides}
- C23C 14/34: Sputtering
- Y10T 428/12576: Boride, carbide or nitride component
- Y10T 428/12583: Component contains compound of adjacent metal
- Y10T 428/12736: Al-base component
- Y10T 428/265: 1 mil or less
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A housing is provided which includes an aluminum or aluminum alloy substrate, an aluminum layer and a corrosion resistant layer formed on the aluminum or aluminum alloy substrate in that order. The corrosion resistant layer is an Al—C—N layer. Then, La ions is implanted in the Al—C—N layer by ion implantation process. The atomic percentages of N and C in the Al—C—N gradient layer gradually increase from the side of Al—C—N gradient layer near the aluminum or aluminum alloy substrate to the other side of Al—C—N gradient layer, away from aluminum or aluminum alloy substrate. Therefore the housing has a high corrosion resistance. A method for making the housing is also provided.

## Claims

### Claim 1

A housing, comprising:
a substrate made of aluminum or aluminum alloy;
an aluminum layer formed on the aluminum or aluminum alloy;
a corrosion resistant layer formed on the aluminum layer;
wherein the corrosion resistant layer is an Al—C—N gradient layer doped with La ions, the atomic percentages of N and C in the Al—C—N gradient layer gradually increase from the side of Al—C—N gradient layer near the aluminum or aluminum alloy substrate to the other side of Al—C—N gradient layer, away from aluminum or aluminum alloy substrate.

### Claim 2 (depends on 1)

The housing as claimed in claim 1, wherein the corrosion resistant layer has a thickness of about 0.5 μm-about 2.0 μm.

### Claim 3 (depends on 1)

The housing as claimed in claim 1, wherein the aluminum layer has a thickness of about 100 nm-about 300 nm.

### Claim 4

A method for surface treating aluminum or aluminum alloy, the method comprising:
providing a substrate made of aluminum or aluminum alloy;
forming an aluminum layer on the substrate by physical vapor deposition;
forming a corrosion resistant layer formed on the aluminum layer, the corrosion resistant layer is an Al—C—N gradient layer doped with La ions which is implanted by ion implantation process, the atomic percentages of N and C in the Al—C—N gradient layer gradually increase from the side of Al—C—N gradient layer near the aluminum or aluminum alloy substrate to the other side of Al—C—N gradient layer, away from aluminum or aluminum alloy substrate.

### Claim 5 (depends on 4)

The method as claim in claim 4, wherein the step of forming Al—C—N gradient layer comprises: simultaneously applying argon, acetylene, and nitrogen, the flux of the argon being from about 100 sccm to about 300 sccm, the flux of the acetylene being from about 10 sccm to about 100 sccm and the flux of the nitrogen being from about 10 sccm to about 20 sccm; applying a bias voltage to the substrate of about −150 V to about −500 V; the flux of the nitrogen and acetylene flow rates are both increased approximately about 10 sccm to about 20 sccm at a depositing interval of about every 10 min to about 15 min. and evaporating the Al—C—N gradient layer taking a total time of about 30 min to about 90 min.

### Claim 6 (depends on 4)

The method as claim in claim 4, wherein, ion implanting La ions comprises: evacuating the processing chamber to maintain a pressure of about 1×10−4 Pa, the process gas maintains a working atmosphere from about 0.1 Pa to about 0.5 Pa in the processing chamber.

### Claim 7 (depends on 6)

The method as claim in claim 6, wherein the step of ion implanting La ions further comprises supplying a RF source power to dissociate the ions from the process gas.

### Claim 8 (depends on 6)

The method as claim in claim 6, wherein the RF source power is controlled from about 30 kV to about 100 kV to form a beam of the ions with an intensity from about 1 mA to about 5 mA.

### Claim 9 (depends on 6)

The method as claimed in claim 6, wherein the density of the ions implanted in the ion implantation layer is of about 1×1016 ions/cm2 to about 1×1018 ions/cm2.

### Claim 10 (depends on 6)

The method as claimed in claim 6, wherein the step of forming the aluminum layer comprises: using argon gas as sputtering gas, the flux of the argon being from about 100 sccm to about 300 sccm, the power of the aluminum targets is of about 2 kw to about 8 kw, the substrate is applied with a negative bias voltage is of about −300 V to about −500 V, vacuum sputtering the aluminum layer takes about 5 min to about 10 min.

### Claim 11 (depends on 4)

The method as claim in claim 4, wherein the method further comprises polishing and ultrasonically cleaning the aluminum or aluminum alloy substrate before forming the aluminum layer.