Insulation materials having apertures formed therein
AssigneeSiemens Energy, Inc.
InventorsDavid S. Segletes, Zhaohui Han
Life of this patent
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Abstract
An improved electrical insulation tape (16) comprising a backing layer (20) and an electrical insulation layer (18) bonded to the backing layer (20) is provided. At least one of the electrical insulation layer (18) and the backing layer (20) includes a plurality of apertures (26) formed therein to improve flow of impregnating resin into the insulation tape (16) during resin impregnation.
Claims10
An electrical insulation material comprising an electrical insulation layer comprising a plurality of apertures formed therein, wherein the apertures have a largest dimension of ten microns or less, and wherein the electrical insulation layer comprises mica.
A method of manufacturing an electrical insulation material comprising:
- forming a plurality of apertures in the electrical insulation material;
- wherein the electrical insulation material comprises a first component and a second component, and wherein the forming comprises selectively removing the first component from the electrical insulation material while leaving said second component substantially intact;
- and
- wherein the electrical insulation material comprises an insulation layer comprising mica.
Dependencies are inferred from the claim text.