Method for manufacturing optical information recording medium, and optical information recording medium

A method of manufacturing an optical information recording medium having a laminate of unit layers each including a resin layer having an uneven surface and a recording layer laminated on the uneven surface of the resin layer, the method including:

• a first resin applying step of applying a first photo-curing resin to one surface of a first substrate;
• a first resin curing step of laminating a first stamper having an uneven surface on the first photo-curing resin applied to the one surface of the first substrate, and irradiating ultraviolet rays onto the first photo-curing resin via the first stamper to cure the first photo-curing resin;
• a second resin applying step of applying a second photo-curing resin to the other surface of the first substrate;
• a second resin curing step of laminating a second stamper having an uneven surface on the second photo-curing resin applied to the other surface of the first substrate, and irradiating ultraviolet rays onto the second photo-curing resin via the first second to cure the second photo-curing resin;
• a first stamper peeling step of peeling the second stamper from the second photo-curing resin;
• and
• a first recording layer laminating step of laminating a first recording layer on a surface of the second photo-curing resin which is exposed by peeling of the second stamper,
• wherein an application area of the first photo-curing resin to the first substrate is set larger than an application area of the second photo-curing resin to the first substrate.

A method of manufacturing an optical information recording medium having a laminate of unit layers each including a resin layer having an uneven surface and a recording layer laminated on the uneven surface of the resin layer, the method including:

• a first resin applying step of applying a first photo-curing resin to one surface of a first substrate;
• a first resin curing step of laminating a first stamper having an uneven surface on the first photo-curing resin applied to the one surface of the first substrate, and irradiating ultraviolet rays onto the first photo-curing resin via the first stamper to cure the first photo-curing resin;
• a second resin applying step of applying a second photo-curing resin to the other surface of the first substrate;
• a second resin curing step of laminating a second stamper having an uneven surface on the second photo-curing resin applied to the other surface of the first substrate, and irradiating ultraviolet rays onto the second photo-curing resin via the first second to cure the second photo-curing resin;
• a first stamper peeling step of peeling the second stamper from the second photo-curing resin;
• a first recording layer laminating step of laminating a first recording layer on a surface of the second photo-curing resin which is exposed by peeling of the second stamper;
• a third resin applying step of applying a third photo-curing resin to a surface of the first recording layer;
• a first substrate fixing step of laminating a second substrate on the third photo-curing resin applied to the surface of the first recording layer, and irradiating ultraviolet rays onto the third photo-curing resin via the second substrate to cure the third photo-curing resin, thereby fixing the second substrate;
• a second stamper peeling step of peeling the first stamper from the first photo-curing resin;
• a second recording layer laminating step of laminating a second recording layer on a surface of the first photo-curing resin which is exposed by peeling of the first stamper;
• a fourth resin applying step of applying the third photo-curing resin to a surface of the second recording layer;
• and
• a second substrate fixing step of laminating a third substrate on the third photo-curing resin applied to the surface of the second recording layer, and irradiating ultraviolet rays onto the third photo-curing resin via the third substrate to cure the third photo-curing resin, thereby fixing the third substrate.