Apparatus and method incorporating discrete passive components in an electronic package

A method of fabrication comprising;

• forming a dielectric insulation layer over a passivation layer formed on a surface of a substrate having circuitry formed therein;
• forming a metal layer over the dielectric insulation layer;
• forming a layer of photosensitive material over the metal layer;
• forming a pattern with the photosensitive material to expose at least one region of the metal layer;
• removing the at least one exposed region of the metal layer using the pattern of photosensitive material as a mask, the removal of the at least one exposed region of the metal layer exposing at least one region of the dielectric insulation layer;
• removing the at least one exposed region of the dielectric insulation layer;
• and
• removing remaining photosensitive material from each remaining area of the metal layer for forming a structure to which a leadframe of an electronic package and an electronic component may be attached, wherein forming the structure comprises forming a bond pad to accept at least two bonds including a first bond to couple the structure to the electronic component and a second bond to couple the structure to a package lead of the leadframe of the electronic package, wherein the package lead is not formed over a surface of the substrate.