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US 8,559,806 B2Granted
Camera module and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorDong Hyun Seo
Life of this patent
Estimating the term…
Abstract
A camera module and a method for manufacturing the same. The camera module includes a lens unit including at least one lens stacked along an optical axis, an autofocusing unit disposed on an object side of the lens unit and automatically controlling a focus of the lens unit, an image sensor unit receiving light incident through the lens unit, and at least one via formed in the lens unit to be penetrated in a thickness direction thereof for an electrical connection of the autofocusing unit.
Claims11
A camera module, comprising:
- a lens unit including at least one lens stacked along an optical axis;
- an autofocusing unit disposed on an object side of the lens unit and automatically controlling a focus of the lens unit;
- an image sensor unit receiving light incident through the lens unit;
- and
- at least one via formed in the lens unit to be penetrated in a thickness direction thereof for an electrical connection of the autofocusing unit,
- wherein the image sensor unit includes a cover glass covering an image formation area in which light transmitting the lens unit is imaged the at least one via is formed by penetrating through the cover glass in a thickness direction thereof.
3 more elements
A method for manufacturing a camera module, comprising:
- stacking at least one lens wafer on which a plurality of lenses are arranged along an optical axis;
- stacking an autofocusing wafer automatically controlling a focus of the lens on an object side of the stacked lens wafer;
- forming at least one via penetrating through the stacked lens wafer in a thickness direction thereof for electrically connecting the autofocusing wafer;
- stacking an image sensor wafer receiving light incident from the lens on an image side of the stacked lens wafer;
- and
- cutting the stacked lens wafer, the autofocusing wafer, and the image sensor wafer for each module,
- wherein the forming of the via is formed to penetrate through a cover glass wafer covering an image formation area of the image sensor wafer in a thickness direction thereof.
4 more elements
Dependencies are inferred from the claim text.