Heat treatment apparatus and method for heating substrate by photo-irradiation

A heat treatment method for heating a substrate by irradiating the substrate with light, comprising:

• a weak irradiation step of performing photo-irradiation of a substrate with a light-emission output that averages out at a first light-emission output and that is kept for 5 to 100 milliseconds within a fluctuation range of plus or minus 30% from the first light-emission output;
• a buffer irradiation step, subsequent to said weak irradiation step, of performing photo-irradiation of the substrate with a light-emission output that increases from the first light-emission output to a second light-emission output that is higher than the first light-emission output over a time in a range of 5 to 50 milliseconds;
• and an intense irradiation step, subsequent to said buffer irradiation step, of performing photo-irradiation of the substrate in accordance with an output waveform that peaks at a third light-emission output that is higher than the second light-emission output and whose irradiation time is between 1 and 5 milliseconds, wherein a rate of increase of the light-emission output in said buffer irradiation step is between 10 and 40% of a rate of increase of the light-emission output until the light-emission output reaches a peak in said intense irradiation step.

A heat treatment method for heating a substrate by irradiating the substrate with light, comprising:

• a buffer irradiation step of performing photo-irradiation of a substrate with a light-emission output that increases up to a first light-emission output over a time in a range of 1 to 100 milliseconds;
• and an intense irradiation step, subsequent to said buffer irradiation step, of performing photo-irradiation of the substrate in accordance with an output waveform that peaks at a second light-emission output that is higher than the first light-emission output and whose irradiation time is between 1 and 5 milliseconds, wherein a rate of increase of the light-emission output in said buffer irradiation step is between 10 and 40% of a rate of increase of the light-emission output until the light-emission output reaches a peak in said intense irradiation step.

A heat treatment method for heating a substrate by irradiating the substrate with light, comprising:

• a weak irradiation step of performing photo-irradiation of a substrate with a light-emission output that averages out at a first light-emission output and that is kept for 5 to 100 milliseconds within a fluctuation range of plus or minus 30% from the first light-emission output;
• a buffer irradiation step, subsequent to said weak irradiation step, of performing photo-irradiation of the substrate with a light-emission output that increases from the first light-emission output to a second light-emission output that is higher than the first light-emission output over a time in a range of 5 to 50 milliseconds;
• and an intense irradiation step, subsequent to said buffer irradiation step, of performing photo-irradiation of the substrate with a light-emission output that averages out at the second light-emission output and that is kept for 1 to 10 milliseconds within a fluctuation range of plus or minus 30% from the second light-emission output.

A heat treatment method for heating a substrate by irradiating the substrate with light, comprising:

• a buffer irradiation step of performing photo-irradiation of a substrate with a light-emission output that increases up to a first light-emission output over a time in a range of 1 to 100 milliseconds;
• and an intense irradiation step, subsequent to said buffer irradiation step, of performing photo-irradiation of the substrate with a light-emission output that averages out at the first light-emission output and that is kept for 1 to 10 milliseconds within a fluctuation range of plus or minus 30% from the first light-emission output.

A heat treatment method for heating a substrate by irradiating the substrate with light, comprising:

• a buffer irradiation step of performing photo-irradiation of a substrate with a light-emission output that increases up to a first light-emission output over a time in the range of 1 to 100 milliseconds;
• an intense irradiation step, subsequent to said buffer irradiation step, of performing photo-irradiation of the substrate with a light-emission output that averages out at the first light-emission output and that is kept for 5 to 10 milliseconds within a fluctuation range of plus or minus 30% from the first light-emission output;
• and an additional irradiation step, subsequent to said intense irradiation step, of performing photo-irradiation of the substrate with a light-emission output that averages out at a second light-emission output that is lower than the first light-emission output and that is kept for 10 to 100 milliseconds within a fluctuation range of plus or minus 30% from the second light-emission output.