Nonvolatile semiconductor memory apparatus and manufacturing method thereof
AssigneePanasonic Corporation
InventorsTakumi Mikawa, Takeshi Takagi
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AssigneePanasonic Corporation
InventorsTakumi Mikawa, Takeshi Takagi
Estimating the term…
A nonvolatile semiconductor memory apparatus including a substrate, lower-layer electrode wires provided on the substrate, an interlayer insulating layer provided with contact holes at locations respectively opposite to the lower-layer electrode wires, resistance variable layers which are respectively connected to the lower-layer electrode wires; and non-ohmic devices which are respectively provided on the resistance variable layers. The non-ohmic devices each has a laminated-layer structure including plural semiconductor layers, a laminated-layer structure including a metal electrode layer and an insulator layer, or a laminated-layer structure including a metal electrode layer and a semiconductor layer. One layer of the laminated-layer structure is embedded to fill each of the contact holes and the semiconductor layer or the insulator layer which is the other layer of the laminated-layer structure has a larger area than an opening of each of the contact holes and is provided on the interlayer insulating layer.
A method of manufacturing a nonvolatile semiconductor memory apparatus comprising:
Dependencies are inferred from the claim text.