Memory systems and method for coupling memory chips
AssigneeIntel Corporation
InventorRandy B. Osborne
Life of this patent
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Abstract
Methods and apparatus for memory systems with memory chips are described. In an embodiment, a system includes a memory controller chip, memory chips, and a module connector each on a first substrate and at least two groups of conductors to provide read data signals from at least some of the memory chips to the memory controller chip and to provide read data signals from the connector to the memory controller chip. Furthermore, a memory module is inserted in the module connector and including memory chips on a second substrate at least some of which are to receive signals from at least some for the memory chips on the first substrate and at least some of which are to provide the read data signals to be provided to the second group of conductors. Other embodiments are described.
Claims17
A memory system comprising:
- a memory controller chip coupled to memory chips and a module connector, wherein the memory controller chip, memory chips, and the module connector are on a first substrate;
- a first group of conductors to provide read data signals from at least some of the memory chips to the memory controller chip;
- a second group of conductors to provide read data signals from the connector to the memory controller chip;
- and
- a memory module, coupled to a continuity module inserted in the connector, including memory chips on a second substrate at least some of which are to receive signals from at least some for the memory chips on the first substrate and at least some of which are to provide the read data signals to be provided to the second group of conductors,
- wherein the continuity module is to couple conductors, from at least some of the memory chips to the connector, to the second group of conductors.
A memory system comprising:
- a memory controller chip coupled to memory chips and a module connector, wherein the memory controller chip, memory chips, and the module connector are on a motherboard;
- and a first group of conductors to provide signals from the memory controller chip to at least some of the memory chips, a second group of conductors to provide signals from at least some of the memory chips to the connector,
- a third group of conductors to provide read data signals from at least some of the memory chips to the memory controller chip,
- a fourth group of conductors to provide read data signals from the connector to the memory controller chip, wherein the third and fourth groups of conductors are point-to-point conductors,
- a memory module, coupled to a continuity module inserted in the connector, including memory chips at least some of which are to receive signals from the second group of conductors and at least some of which are to provide the read data signals to the connector for the fourth group of conductors, wherein the continuity module is to couple conductors from the second group of the conductors and the fourth group of conductors.
A method for coupling memory modules comprising:
- providing signals on a first group of conductors from a memory controller chip to at least some memory chips;
- providing signals on a second group of conductors from at least some of memory chips to a module connector;
- providing read data signals on a third group of conductors from at least some of memory chips to the memory controller chip;
- and
- providing read data signals on a fourth group of conductors from the connector to the memory controller chip, wherein the memory module chip, memory chips, and a module connector each on a motherboard, and the third and fourth group of conductors are point-to-point conductors,
- wherein a memory module, to be coupled to a continuity module that is inserted in the connector, is to comprise memory chips at least some of which are to receive signals from the second group of conductors and at least some of which are to provide the read data signals to the connector for the fourth group of conductors and wherein the continuity module is to couple conductors from the second group of conductors and the fourth group of conductors.
Dependencies are inferred from the claim text.