Thin multi-chip flex module
AssigneeMicroelectronics Assembly Technologies, Inc.
InventorsJames E. Clayton, Zakaryae Fathi
Life of this patent
Estimating the term…
Abstract
A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.
Claims12
A multichip module comprising:
- a flexible dielectric sheet having a first conductive pattern on a first surface thereof and a second conductive pattern and a bonding layer on at least a portion of a second surface thereof, wherein said dielectric sheet is configured for reel-to-reel processing;
- a plurality of microelectronic devices disposed on said first surface so that said microelectronic devices are operably coupled to said first and second conductive patterns;
- and,
- a 180° fold about a selected axis in said dielectric sheet so that a first portion of said second surface is brought into contact with a second portion of said second surface and bonded thereto and an electrical circuit is completed between selected points on said second conductive pattern on said first and second portions of said second surface while at least a portion of said dielectric sheet is left unbonded, so that a bifurcated portion is formed, and contact pads are formed on said bifurcated portion.
A multichip module comprising:
- a flexible dielectric sheet having a first conductive pattern on a first surface thereof and a second conductive pattern and a bonding layer on at least a portion of a second surface thereof;
- a plurality of microelectronic devices disposed on said first surface so that said microelectronic devices are operably coupled to said first and second conductive patterns;
- a 180° fold about a selected axis in said dielectric sheet so that a first portion of said second surface is brought into contact with a second portion of said second surface and bonded thereto and an electrical circuit is completed between selected points on said second conductive pattern on said first and second portions of said second surface while at least a portion of said dielectric sheet is left unbonded, so that a bifurcated portion is formed, and contact pads are formed on said bifurcated portion;
- and,
- a substantially rigid frame.
A multichip module comprising:
- a flexible dielectric sheet having a first conductive pattern on a first surface thereof and a second conductive pattern and a bonding layer on at least a portion of a second surface thereof;
- a plurality of microelectronic devices disposed on said first surface so that said microelectronic devices are operably coupled to said first and second conductive patterns;
- a 180° fold about a selected axis in said dielectric sheet so that a first portion of said second surface is brought into contact with a second portion of said second surface and bonded thereto and an electrical circuit is completed between selected points on said second conductive pattern on said first and second portions of said second surface while at least a portion of said dielectric sheet is left unbonded, so that a bifurcated portion is formed, and contact pads are formed on said bifurcated portion;
- and,
- a heat spreading cover.
Dependencies are inferred from the claim text.