Removable IC package stiffening brace and method
AssigneeAlcatel Lucent
InventorsPaul J. Brown, Alex L. Chan
Life of this patent
Estimating the term…
Abstract
Various exemplary embodiments relate to a brace for use with an integrated circuit (IC), and to an IC package with a brace, having a main body portion and a fastening portion for mechanically fastening the main body portion to the IC, by for example clipping or sliding attachment. Other exemplary embodiments relate to a method of stabilizing an IC during an operation carried out on the IC, such as a soldering operation, involving for example steps of attaching a brace to the IC, performing the operation on the IC, and/or removing the brace after performing the operation.
Claims18
A brace for use with an integrated circuit (IC), comprising:
- a main body portion having a flat surface held against a central area of a top surface of the IC, wherein the main body portion resists warping or bending of the IC;
- and
- a fastening portion for mechanically fastening the main body portion to the IC, wherein the fastening portion comprises a hinged arm having a tab that releasably engages the IC,
- wherein the brace exposes solder joints of the IC located on the bottom of the IC.
A brace for use with an integrated circuit (IC), comprising:
- a main body portion having a flat surface held against a central area of top surface of the IC, wherein the main body portion resists warping or bending of the IC;
- and
- a fastening portion for mechanically fastening the main body portion to the IC,
- wherein the brace is slidable onto the IC from an end of the IC,
- wherein the brace exposes solder joints of the IC located on the bottom of the IC.
A brace for use with an integrated circuit (IC), comprising:
- a main body portion having a flat surface held against a central area of a top surface of the IC, wherein the main body portion resists warping or bending of the IC;
- and
- a fastening portion for mechanically fastening the main body portion to the IC, wherein the main body has a plurality of relief areas therein,
- wherein the brace exposes solder joints of the IC located on the bottom of the IC.
A brace for use with an integrated circuit (IC), comprising:
- a main body portion having a flat surface held against a central area of a top surface of the IC, wherein the main body portion resists warping or bending of the IC;
- and
- a fastening portion for mechanically fastening the main body portion to the IC, wherein the flat surface of the main body portion comprises two pieces attachable to each other,
- wherein the brace exposes solder joints of the IC located on the bottom of the IC.
An IC package assembly comprising:
- an integrated circuit (IC) having a top surface, a bottom surface, and a plurality of solder joints on the bottom surface;
- and
- a brace attachable to the IC, the brace comprising:
- a main body portion having a flat surface held against a central portion of the top surface of the IC that resists warping or bending of the IC;
- and
- a fastening portion for mechanically fastening the main body portion to the IC, wherein the fastening portion comprises a hinged arm having a tab that releasably engages the IC.
An IC package assembly comprising:
- an integrated circuit (IC) having a top surface, a bottom surface, and a plurality of solder joints on the bottom surface;
- and
- a brace attachable to the IC, the brace comprising:
- a main body portion having a flat surface held against a central portion of the top surface of the IC that resists warping or bending of the IC;
- and
- a fastening portion for mechanically fastening the main body portion to the IC, wherein the brace is slidable onto the IC from an end of the IC.
An IC package assembly comprising:
- an integrated circuit (IC) having a top surface, a bottom surface, and a plurality of solder joints on the bottom surface;
- and
- a brace attachable to the IC, the brace comprising:
- a main body portion having a flat surface held against a central portion of the top surface of the IC that resists warping or bending of the IC;
- and
- a fastening portion for mechanically fastening the main body portion to the IC, wherein the main body has a plurality of relief areas therein.
An IC package assembly comprising:
- an integrated circuit (IC) having a top surface, a bottom surface, and a plurality of solder joints on the bottom surface;
- and
- a brace attachable to the IC, the brace comprising:
- a main body portion having a flat surface held against a central portion of the top surface of the IC that resists warping or bending of the IC;
- and
- a fastening portion for mechanically fastening the main body portion to the IC, wherein the flat surface of the main body portion comprises two pieces attachable to each other.
Dependencies are inferred from the claim text.