Cooling device for cooling a semiconductor die

A method of cooling a semiconductor die, the method comprising:

• thermally coupling a heat dissipator to the semiconductor die to dissipate heat from the semiconductor die;
• mounting the heat dissipator to a housing so that the heat dissipator is disposed within the housing;
• dispensing a forced fluid flow through a first aperture defined on the housing;
• directing the forced fluid flow into or out of the housing along a fluid path in a first direction between the first aperture defined on the housing and the heat dissipator;
• and
• directing the forced fluid flow along the heat dissipator in a second direction out of or into the housing that is different than the first direction.

A cooling device for cooling a semiconductor die, the device comprising:

• plurality of heat dissipators, each heat dissipator being thermally couplable to a corresponding semiconductor die, the heat dissipators being arranged to dissipate heat from the corresponding semiconductor dies;
• a plurality of apertures, each aperture being arranged to receive a corresponding heat dissipator therethrough;
• a housing to which the heat dissipators are mounted;
• a first fluid flow passage for providing a forced fluid flow within the housing;
• and
• a fluid flow path arranged to direct fluid in a first direction between the first fluid flow passage and the heat dissipators, and further arranged to force fluid along the heat dissipators in a second direction different to the first direction.