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US 8,559,139 B2Granted
Sensor module and method for manufacturing a sensor module
AssigneeIntel Mobile Communications GmbH
InventorHorst Theuss
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a sensor module includes providing a substrate comprising an array of magnetically sensitive elements on a first main face of the substrate. An array of conducting lines is applied over the first main face of the substrate. An array of electrical interconnects is applied over the first main face of the substrate. The substrate is singulated after application of the electrical interconnects.
Claims20
A sensor module comprising:
- a semiconductor die comprising a magnetically sensitive element;
- a plurality of electrical interconnect elements;
- a redistribution layer electrically coupling the plurality of electrical interconnect elements, the magnetically sensitive element, and a conducting coil;
- and
- a mold layer encapsulating the semiconductor die.
2 more elements
A sensor module, comprising:
- a first semiconductor die comprising a magnetically sensitive element;
- a second semiconductor die;
- a plurality of electrical interconnect elements;
- a redistribution layer electrically coupling the first semiconductor die to the second semiconductor die and electrically coupling the magnetically sensitive element, the plurality of electrical interconnect elements, and a conductor coil;
- and
- a mold layer encapsulating the first and second semiconductor dies.
3 more elements
A sensor module comprising:
- a semiconductor die comprising a magnetically sensitive element;
- a plurality of electrical interconnect elements;
- a laminate electrically coupling the plurality of electrical interconnect elements, the magnetically sensitive element, and a conducting coil;
- and
- a mold layer encapsulating the semiconductor die.
2 more elements
Dependencies are inferred from the claim text.