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US 8,558,990 B2Granted
Method of exposing a semiconductor wafer and exposure apparatus
AssigneeElpida Memory, Inc.
InventorsMasayoshi Danbata, Hisanori Ueno
Life of this patent
Estimating the term…
Abstract
An exposure method includes the following processes. An autofocus scan process is performed to detect a defocused portion of a first resist film over a semiconductor wafer and to generate a detection signal that indicates the defocused portion detected. A first exposure scan process is performed while selectively blinding the first resist film, with reference to a detection signal related to the defocused portion detected.
Claims20
An exposure method comprising:
- performing an autofocus scan process to detect a defocused portion of a first resist film over a semiconductor wafer and to generate a detection signal that indicates the defocused portion detected;
- and
- performing a first exposure scan process while selectively blinding the first resist film, with reference to the detection signal.
An exposure method comprising:
- measuring height-direction positions on a surface of a first resist film over a semiconductor wafer;
- calculating differences between measured heights and an adjustable height to identify the differences as calculated defocus values, the measured heights being respectively defined by the height-direction positions measured;
- comparing the calculated defocus values to a reference defocus value at positions on the surface of the first resist film;
- identifying the defocused portion at a position where the calculated defocus value exceeds the reference defocus value;
- generating a detection signal that indicates the defocused portion detected;
- and
- performing a first exposure scan process while blinding the defocused portion, with reference to the detection signal.
4 more elements
An exposure method comprising:
- measuring height-direction positions on a surface of a first resist film over a semiconductor wafer;
- detecting a defocused portion with reference to information related to the height-direction positions measured;
- and
- performing a first exposure scan process while blinding the defocused portion, with reference to the detection signal.
1 more element
Dependencies are inferred from the claim text.