Solid-state image pickup element, a method of manufacturing the same and electronic apparatus using the same

An electronic apparatus, comprising:

• a solid-state image pickup element including a plurality of pixels each having a photoelectric conversion portion for converting a quantity of incident light into an electric signal, and a plurality of pixel transistors;
• wiring layers formed on one surface side of a semiconductor substrate having said plurality of pixels formed therein, a light made incident from a side opposite to the one surface having said wiring layers formed thereon being received by corresponding one of the photoelectric conversion portions;
• a scribe line region formed in a periphery of a pixel portion composed of said plurality of pixels;
• and square-shaped termination detecting portions for determining a polishing termination and each having higher hardness than that of said semiconductor substrate and formed in said scribe line region, and at least a portion of the termination detecting portions being formed at a same depth in the substrate as the photoelectric conversion portions and having a top surface exposed by polishing such that the top surface of the square-shaped termination detecting portions is at a same level as a surface of the substrate, each of said square-shaped termination detecting portions having a side parallel with a direction of said scribe line of said semiconductor substrate;
• an optical system for guiding the incident light to an image pickup portion of said solid-state image pickup element;
• and
• a signal processing circuit for processing an output signal from said solid-state image pickup element.