PCB and camera module having the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorWoong-Tae Jung
Life of this patent
Estimating the term…
Abstract
A print circuit board and a camera module having the same are disclosed. A printed circuit board of the present invention that is thermally coupled to an electronic device includes: a binding part, which has a binding pad coupled to the electronic device; a first ground, which is arrayed in an area heated at the time of thermal binding; and a second ground, which is connected to the first ground and arrayed adjacent to the binding pad. A multi-layered printed circuit board that is thermally coupled can be formed by forming a heat transfer path that is connected from the heating area to the binding pad through a ground.
Claims8
A printed circuit board thermally coupled to an electronic device, comprising:
- a multi-layered circuit layer extending horizontally;
- a binding pad disposed on and in contact with an upper surface of the circuit layer and coupled to the electronic device;
- a first ground disposed on a lower surface of the circuit layer and arrayed in an area heated at the time of thermal binding;
- a second ground, connected to the first ground and disposed on and in contact with the upper surface of the circuit layer and arrayed adjacent to the binding pad;
- and
- a via directly connecting the first ground to the second ground, wherein:
- a portion of the first ground is arrayed on an opposite side of the circuit layer to a side on which the binding pad is disposed, such that a horizontal planar position of said portion of the first ground corresponds to a horizontal planar position of the binding pad and that said portion of the first ground covers and is superimposed on at least a portion of the binding pad.
A camera module, comprising:
- a camera head unit, having a lens and an image sensor;
- a printed circuit board, coupled to the camera head unit;
- and
- a thermal binding member, interposed between the camera head unit and the printed circuit board, wherein:
- the printed circuit board comprises:
- a multi-layered circuit layer extending horizontally;
- a binding pad disposed on and in contact with an upper surface of the circuit layer and coupled to the thermal binding member;
- a first ground disposed on a lower surface of the circuit layer and arrayed in an area heated at the time of thermal binding;
- a second ground connected to the first ground and disposed on and in contact with the upper surface of the circuit layer and arrayed adjacent to the binding pad;
- and
- a via directly connecting the first ground to the second ground,
- a portion of the first ground is arrayed on an opposite side of the circuit layer to a side on which the binding pad is disposed, such that a horizontal planar position of said portion of the first ground corresponds to a horizontal planar position of the binding pad and that said portion of the first ground covers and is superimposed on at least a portion of the binding pad.
Dependencies are inferred from the claim text.