Image pickup lens and image pickup apparatus

#This is a U.S. National Phase Application under 35 USC 371 of International Application PCT/JP2010/067533 filed on Oct. 6, 2010.

#This application claims the priority of JP 2009-239640 filed on Oct. 6, 2009, the entire content of which is hereby incorporated by reference.

#The present invention relates to an image pickup lens suitable for an image pickup apparatus employing a solid-state image pickup element such as a CCD (Charge Coupled Devices) type image sensor and a CMOS (Complementary Metal-Oxide Semiconductor) type image sensor, and to an image pickup apparatus.

#FIG. 1 shows a perspective view illustrating an image pickup apparatus 50 relating to the present embodiment.

#FIG. 2 shows a sectional view illustrating the structure of FIG. 1 which is cut along arrowed lines II-II, and is viewed in the direction of the arrows.

#Each of FIGS. 3a and 3b shows a condition that image pickup apparatus 50 is mounted on cell phone 100 as a mobile terminal.

#The embodiment of the present invention will be described with referring to the drawings. FIG. 1 is a perspective view of image pickup apparatus 50 relating to the present embodiment. FIG. 2 is a sectional view illustrating the structure of FIG. 1 which is cut along arrowed lines II-II and is viewed in the arrowed direction. As shown in FIG. 2, image pickup apparatus 50 includes CMOS type image sensor 51 as a solid-state image pickup element having photoelectric conversion section 51a; image pickup lens 10 for forming a subject image onto photoelectric conversion section 51a of the image sensor 51; substrate 52 supporting image sensor 51 and including an external connecting terminal (which is unillustrated) for transmitting and receiving electric signal of the image sensor 51. They are integrally formed in one body.

#The above image sensor 51 includes photoelectric conversion section 51a representing a light-receiving section, on the central portion of a surface on the light-receiving side of the image sensor 51, and is connected to a signal processing circuit which is not illustrated, wherein on the photoelectric conversion section 51a, pixels (photoelectric conversion elements) are arranged on a two-dimensional basis. The signal processing circuit is composed of a drive circuit section that obtains signal electric charges by driving respective pixels in succession, A/D converting section that converts each signal electric charge into digital signal and of a signal processing section that forms an output of image signal by using the digital signal. Around the outer edge of the light-receiving-side plane of image sensor 51, many pads (which are not illustrated) are provided and connected with substrate 52 through wires which are not illustrated. The image pickup element 51 converts the signal charges from the photoelectric conversion section 51a into image signal such as digital YUV signal, and outputs it to a predetermined circuit on substrate 52 through wires (which are not illustrated). Reference sign Y represents luminance signal, U (=R−Y) represents color difference signal between red and the luminance signal, and V (=B−Y) represents color difference signal between blue and the luminance signal. Hereupon, the solid-state image pickup element is not limited to the above-described CMOS type image sensor, but another element such as a CCD can be employed.

#Substrate 52 supporting image sensor 51 is connected to image sensor 51 with wires which are not illustrated so as to enable communication between them.