Camera module and manufacturing method thereof
AssigneeLG Innotek Co., Ltd.
InventorYounback Jung
Life of this patent
Estimating the term…
Abstract
Disclosed is a camera module and a manufacturing method thereof, wherein the camera module includes a PCB (Printed Circuit Board) mounted with an image sensor, a holder fixed at the PCB, with one side formed with an optical transmission hole and the other side being opened, one or more lenses to be inserted into the holder, and a fixture ring to be inserted into the holder and fixed at an image sensor for fixing one or more lenses, whereby occurrence of defect caused by introduction of foreign objects during assembly of camera module can be minimized, and structure of camera module can be simplified to facilitate the assembling process and to reduce the assembling time.
Claims15
A camera module comprising:
- a PCB (Printed Circuit Board) having an image sensor directly mounted thereon;
- a holder on the PCB, wherein one side of the holder is formed with an optical transmission hole and the other side of the holder is opened;
- and the holder comprises a lens mounting portion, a fixture ring mounting portion, and a tapered-off infusion portion formed at a bottom surface of the fixture ring mounting portion and configured to pour in an adhesive;
- at least one lens disposed in the lens mounting portion;
- and
- a fixture ring, wherein a lateral surface of the fixture ring is fixed to an inner surface of the holder by the adhesive poured through the infusion portion,
- wherein an upper surface of the fixture ring supports a bottom surface edge of the lens nearest to the image sensor,
- wherein a bottom surface of the fixture ring is directly fixed to an upper surface of the image sensor,
- wherein the fixture ring comprises a filter seating portion having a filter mounted therein and comprising a first region formed at an upper surface thereof and a second region formed at a lower surface thereof,
- wherein the first region of the filter seating portion has a tapered-off shape such that an inner opening of the first region becomes narrower as a distance from the image sensor increases,
- wherein the second region of the filter seating portion has a width that is greater than that of the first region of the filter seating portion, and
- wherein the image sensor is disposed between the fixture ring and the PCB.
A manufacturing method of a camera module, the method comprising:
- mounting an image sensor directly on a PCB (Printed Circuit Board);
- inserting at least one lens into a lens mounting portion of a holder;
- inserting a fixture ring into a fixture ring mounting portion of the holder to support a bottom surface edge of the lens nearest to the image sensor;
- fixing the fixture ring at an inner surface of the holder by an adhesive poured through a tapered-off infusion portion of the holder, wherein the infusion portion has a tapered-off shape and is formed at a corner connecting a bottom surface of the holder and the inner surface of the holder, and wherein the infusion portion is spaced apart from both the image sensor and the fixture ring;
- fixing an IR (Infrared) filter in a filter seating portion of the fixture ring;
- fixing the fixture ring to the image sensor of the PCB;
- and
- fixing the holder to the PCB.
Dependencies are inferred from the claim text.