Vialess integration for dual thin films—thin film resistor and heater

A process for forming an integrated heat-trimmable resistor comprising:

• depositing on a substrate a thin-film heating material proximal a thin-film resistive element, wherein the thin-film resistive element connects to a conductive interconnect formed on a side of the thin-film resistive element that is opposite a side facing the thin-film heating material;
• patterning the thin-film heating material to form a thin-film heating element;
• and
• depositing, after the depositing of the thin-film heating material, a first conductive interconnect material to be electrically connected to the thin-film heating element.

A process for forming electrical contacts to two integrated thin-film layers comprising:

• depositing on a substrate a first thin-film layer to be electrically connected to an underlying conductive interconnect;
• depositing proximal the first thin-film layer a second thin-film layer to be electrically connected to a second conductive interconnect;
• and
• depositing on the substrate subsequent the deposition of the second thin-film layer the second conductive interconnect.