Apparatus for improving transmission bandwidth

A communication device comprising:

• a substrate;
• a package;
• and
• an apparatus,
• wherein the apparatus comprises a signal transmission line, side grounds located at two sides of the signal transmission line, and a capacitor disposed between the signal transmission line and the side grounds,
• wherein the signal transmission line comprises a microstrip line,
• wherein the signal transmission line and the side grounds together form a coplanar waveguide transmission line,
• wherein the apparatus is disposed on the substrate or the package, or, both the substrate and the package are disposed with the apparatus for improving transmission bandwidth,
• wherein the signal transmission line and the side grounds are disposed on the substrate, and
• wherein the substrate and a pad of the package are connected through a bonding wire.

An apparatus comprising:

• a signal transmission line;
• side grounds located at two sides of the signal transmission line;
• and
• a capacitor disposed between the signal transmission line and the side grounds,
• wherein the signal transmission line comprises a microstrip line,
• wherein the signal transmission line and the side grounds together form a coplanar waveguide transmission line,
• wherein the signal transmission line and the side grounds are disposed on a pad inside a package;
• and
• wherein the pad inside the package and a substrate are connected through a bonding wire.