High-frequency module
AssigneeMurata Manufacturing Co., Ltd.
InventorsHisanori Murase, Takanori Uejima
Life of this patent
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Abstract
In a high-frequency module, a duplexer element and a matching element are mounted on a surface of a multilayer substrate. On a layer close to the surface, an individual-terminal-side wiring electrode connected to an individual terminal of the duplexer element is provided. On two layers below the layer close to the surface, first and second ground electrodes are respectively provided. On a layer below the layers on which the first and second ground electrodes are provided, a common-terminal-side wiring electrode connected to the common terminal of the duplexer element and one end of the matching element is provided. On a layer close to a bottom surface of the multilayer substrate, a third ground electrode connected to the other end of the matching element is provided.
Claims8
A high-frequency module comprising:
- a multilayer substrate;
- a duplexer mounted on the multilayer substrate and including a common terminal and a plurality of individual terminals connected to the common terminal through different filters;
- and
- a matching circuit mounted on the multilayer substrate or defined by an electrode pattern included in the multilayer substrate and being connected to the common terminal of the duplexer;
- wherein
- the multilayer substrate includes:
- an individual-terminal-side wiring electrode defined by an electrode pattern provided on a layer of the multilayer substrate;
- a common-terminal-side wiring electrode defined by an electrode pattern provided on a different layer of the multilayer substrate from that of the individual-terminal- side wiring electrode;
- and
- first and second ground electrodes provided on different layers between the layer including the common-terminal-side wiring electrode and the layer including the individual-terminal-side wiring electrode in a lamination direction of the layers;
- one of the first and second ground electrodes is arranged so as to overlap the individual-terminal-side wiring electrode but not the common-terminal-side wiring electrode in the lamination direction;
- and
- the other of the first and second ground electrodes is arranged to overlap both of the individual-terminal side wiring electrode and the common-terminal-side wiring electrode in the lamination direction.
Dependencies are inferred from the claim text.