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US 8,558,636 B2Granted
Package embedded equalizer
AssigneeIntel Corporation
InventorsJaemin Shin, Pascal A. Meier, Telesphor Kamgaing, Kemal Aygun
Life of this patent
Estimating the term…
Abstract
A passive equalizer circuit is embedded within a substrate of a package containing an integrated circuit. It is believed that substantial reduction in uneven frequency dependent loss may be achieved for interconnects interconnecting the integrated circuit with other integrated circuits on a printed circuit board. Other aspects are described and claimed.
Claims21
A device, comprising:
- a printed circuit board;
- and
- an integrated circuit protective package which includes a substrate, said integrated circuit protective package being mounted on said printed circuit board, said integrated circuit protective package having a die supported by said integrated circuit package substrate, said die having a first integrated circuit packaged by said integrated circuit protective package so that said die is disposed within and protected by said integrated circuit protective package, and said integrated circuit protective package further having a passive equalizer circuit embedded within said integrated circuit protective package substrate supporting said die and electrically coupled to said first integrated circuit of said die.
A method, comprising:
- transmitting a signal from the output of a first integrated circuit on a first die packaged within and protected by a first integrated circuit protective package mounted on a printed circuit board, to the input of a second integrated circuit on a second die packaged within and protected by a second integrated circuit protective package;
- wherein said transmitting includes conditioning said signal using a passive equalizer circuit embedded in a package substrate of one of said first and second integrated circuit protective packages, said package substrate supporting one of said first and second dies of said one of said first and second integrated circuit protective packages.
A method, comprising:
- embedding a passive equalizer circuit within a protective package substrate;
- positioning a die having a first integrated circuit so that the die is supported by the protective package substrate;
- electrically coupling the integrated circuit of the die to the passive equalizer circuit embedded within the protective package substrate;
- and
- packaging the die within a protective package which includes the protective package substrate so that the die is disposed within and protected by the protective package.
2 more elements
Dependencies are inferred from the claim text.