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US 8,558,569 B2Granted
Opener for test handler
AssigneeTechwing Co., Ltd.
InventorsYun-Sung Na, Tae-Hung Ku, Jung-Woo Hwang
Life of this patent
Estimating the term…
Abstract
An opener for a test handler is provided. Even when holding members of inserts of a carrier board are manipulated to release semiconductor devices that have been in a held state, a predetermined distance can remain between an upper surface of the opening plate and a lower surface of the insert, thus preventing the inserts from becoming defective.
Claims2
A test handler, the test handler comprising:
- a carrier board having an insert, the insert having a holding member to hold a semiconductor device loaded onto insert,
- an opening plate provided below the insert of the carrier board, the opening plate having an opening pin manipulating the holding member to release a held state of the semiconductor device loaded onto the insert;
- and
- a drive source moving the opening plate towards or away from the insert of the carrier board, so that when the opening plate is moved towards the insert of the carrier board, the holding member is manipulated by the opening pin to release the held state of the semiconductor device, and when the opening plate is moved away from the insert of the carrier board, the holding member is released from the opening pin so that the held state of the semiconductor device is maintained,
- wherein when the manipulation of the holding member by moving the opening pin towards the insert of the carrier board to release the held state of the semiconductor device has been completed, a predetermined distance remains between the opening plate and the insert,
- wherein the opening plate has a close contact prevention protrusion preventing a facing surface of the opening plate that faces the insert of the carrier board from coming into contact with the insert to remain at the predetermined distance therefrom,
- wherein the close contact prevention protrusion is located at a position corresponding to a frame of the carrier board, and
- wherein the predetermined distance is greater than a thickness of the semiconductor device, so that even if the semiconductor device is placed on the facing surface of the opening plate, the holding member is correctly manipulated.
5 more elements
Dependencies are inferred from the claim text.