Chip stack structure and manufacturing method thereof
AssigneeMacronix International Co., Ltd.
InventorShih-Hung Chen
Life of this patent
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Abstract
A chip stack structure and a manufacturing method thereof are provided. The chip stack structure comprises a plurality of chips, a vertical conductive line, a plurality of insulating films and a fluid. The chips are overlapped. The vertical conductive line is electrically connected to some of the chips. The vertical conductive line is disposed at the outside of a projection area of some of the chips. Each chip is disposed in one of the insulating films. The channels which are hollow are formed in one of the insulating films. The fluid is disposed in the channels.
Claims13
A chip stack structure, comprising:
- a plurality of chips, wherein the chips are overlapped;
- a vertical conductive line, electrically connected to some of the chips, wherein the vertical conductive line is disposed at the outside of a projection area of some of the chips;
- a plurality of insulating films, wherein each chip is disposed in one of the insulating films, and a plurality of channels which are hollow are formed in one of the insulating films;
- and
- a fluid, disposed in the channels.
A manufacturing method of a chip stack structure, comprising:
- providing a carrier;
- providing a plurality of chips;
- forming a vertical conductive line, wherein the vertical conductive line is disposed at the outside of a projection area of one of the chips;
- stacking the chips, the vertical conductive line electrically connecting some of the chips;
- providing a plurality of insulating films, wherein one of the insulating films is disposed on the carrier, each chip is disposed in one of the insulating films;
- forming a plurality of channels which are hollow in one of the insulating films;
- and
- disposing a fluid in the channels.
Dependencies are inferred from the claim text.