Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer

A method of making a semiconductor device, comprising:

• providing a semiconductor die;
• forming a conductive via through the semiconductor die with a portion of the conductive via extending above a surface of the semiconductor die;
• forming a first insulating layer over the surface of the semiconductor die and conductive via;
• and
• removing a first portion of the first insulating layer while leaving a second portion of the first insulating layer as a guard ring around the conductive via.

A method of making a semiconductor device, comprising:

• providing a semiconductor die;
• forming a conductive via through the semiconductor die with a portion of the conductive via extending above a surface of the semiconductor die;
• forming a guard ring over the surface of the semiconductor die around the conductive via;
• forming a first insulating layer over the surface of the semiconductor die, guard ring, and conductive via;
• and
• removing a portion of the first insulating layer to expose the conductive via and guard ring.

A semiconductor device, comprising:

• a semiconductor die;
• a conductive via formed through the semiconductor die with a portion of the conductive via extending above a surface of the semiconductor die;
• a guard ring formed over the surface of the semiconductor die around the conductive via;
• and
• a first insulating layer formed over the surface of the semiconductor die and conductive via to expose the guard ring and conductive via.