Patternable adhesive composition, semiconductor package using the same, and method of manufacturing semiconductor package

A patternable adhesive composition comprising:

• at least one alkali soluble resin comprising an alkali soluble group and an acryloyl group;
• at least one radically polymerizable compound;
• at least one thermosettable compound;
• and
• at least one photo-radical initiator,
• wherein
• the at least one alkali soluble resin has a weight-average molecular weight of about 5 to about 30 kiloDaltons and a glass transition temperature of about 100° C. or higher,
• the at least one alkali soluble resin has an acid value of about 30 to about 100 milligrams KOH per gram,
• the patternable adhesive composition has a total acid value of about 40 to about 60 milligrams KOH per gram, and
• a film of the patternable adhesive composition has a dissolution rate of about 0.1 micrometer per second or more when contacted with a 2.38 percent by weight tetramethylammonium hydroxide developing solution, and
• a film of the patternable adhesive composition having at least a portion exposed to radiation has a thickness variation of the exposed portion of less than about 5% after an exposing to irradiation process and a developing process.