Methods of making compliant semiconductor chip packages

A method of making a semiconductor chip package comprising:

• (a) providing a compliant layer over a first portion of a contact bearing face of a semiconductor chip such that a second portion of the contact bearing face is not covered by the compliant layer, said compliant layer having a bottom surface adjacent the contact bearing face, a top surface facing away from the bottom surface, and at least one sloping surface between the top surface and the bottom surface, the compliant layer being spaced apart in a direction along the contact bearing face from at least one contact adjacent to the sloping surface and the compliant layer having a low modulus of elasticity;
• and
• (b) forming bond ribbons of conductive material deposited onto at least the compliant layer and the contacts, wherein each said bond ribbon electrically connects one of said contacts to an associated conductive terminal at said top surface of said compliant layer,
• wherein each of at least some of said bond ribbons includes a flexible strip portion extending along said sloping surface of said compliant layer, and a second portion extending away from said compliant layer towards one of said contacts, said flexible strip portions being spaced apart from one another on said sloping surface from said bottom surface to said top surface, wherein said compliant layer is readily compressible in directions transverse to its surfaces so as to permit movement of said flexible strip portion relative to said second portion.