Back to results
US 8,558,384 B2Granted
Interconnect structure containing various capping materials for electrical fuse and other related applications
AssigneeInternational Business Machines Corporation
InventorsLouis L. Hsu, William R. Tonti, Chih-Chao Yang
Life of this patent
Estimating the term…
Abstract
A design structure is provided for interconnect structures containing various capping materials for electrical fuses and other related applications. The structure includes a first interconnect structure having a first interfacial structure and a second interconnect structure adjacent to the first structure. The second interconnect structure has second interfacial structure different from the first interfacial structure.
Claims6
A structure comprising:
- a first macro having a metal wiring layer on a first level electrically connected through an opening in a first capping layer to a metal wiring layer on a second layer and a second capping layer over the metal wiring layer on the second layer which has a first electromigration (EM) resistance;
- and
- a second macro having a metal wiring layer on the first level electrically connected through an opening in a first capping layer to a metal wiring layer on the second layer and a second capping layer over the metal wiring layer on the second layer which has a second electromigration (EM) resistance different from the first electromigration (EM) resistance.
Dependencies are inferred from the claim text.