Semiconductor package module
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJin O Yoo
Life of this patent
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Abstract
There is provided a semiconductor package module capable of minimizing a thickness of the module in spite of including an electronic element having a large size. The semiconductor package module includes: a semiconductor package having a shield formed on an outer surface and a side thereof and at least one receiving part provided in a lower surface thereof, the receiving part having a groove shape; and a main substrate having at least one large element and the semiconductor package mounted on one surface thereof, wherein the large element is received in the receiving part of the semiconductor package and is mounted on the main substrate.
Claims7
A semiconductor package module, comprising:
- a semiconductor package having at least one receiving part provided in a lower surface thereof, the receiving part having a groove shape;
- and
- a main substrate having at least one large element and the semiconductor package mounted on one surface thereof,
- wherein the large element is received in the receiving part of the semiconductor package and is mounted on the main substrate,
- wherein the semiconductor package includes a substrate, at least one electronic element mounted on one surface of the substrate, and a shield having the at least one electronic element received therein and coupled to the substrate, and
- wherein a thickness of the large element is greater than a thickness of the substrate of the semiconductor package.
Dependencies are inferred from the claim text.